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Normal-temperature storage type epoxy resin composition for semiconductor packaging

An epoxy resin, room temperature storage technology, used in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as inability to long-term storage

Inactive Publication Date: 2018-06-05
江苏科化新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The applicant unexpectedly found that by complexing the traditional accelerator, the activity of the complex at room temperature is reduced, but the activity is completely restored at a high temperature of 130-180 ° C, which can solve the problem of the traditional epoxy resin polymer at room temperature. Gradual aggregation, the problem of not being able to store for a long time

Method used

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  • Normal-temperature storage type epoxy resin composition for semiconductor packaging
  • Normal-temperature storage type epoxy resin composition for semiconductor packaging
  • Normal-temperature storage type epoxy resin composition for semiconductor packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Cycloaliphatic epoxy resin A1 (HP-4700 manufactured by Dainippon Ink, Japan) 8wt%

[0031] Anhydride B1 (Taiwan Nanya "tetrahydrophthalic anhydride") 6wt%

[0032] Silica powder D1 (d50 is 20μm) 82wt%

[0033] Flame retardant brominated epoxy resin and antimony trioxide (the weight ratio of brominated epoxy resin and antimony trioxide is 10:1) 1.5wt%

[0034] Curing accelerator C1 (TPP-BQ manufactured by Shanghai Huichuang) 0.05wt%

[0035] Carnauba wax 0.5wt%

[0036] Inorganic ion scavenger 0.45wt% (Japan TOAGOSEI Co., Ltd system IXE500 (Bi 2 o 3 ·3H 2 O))

[0037] γ-glycidyl propyl ether trimethoxysilane 0.5wt%

[0038] Carbon black 0.5wt%

[0039] Liquid silicone oil 0.5wt%

[0040] Silicone rubber powder 0.5wt% (d50 is 1μm)

[0041] After weighing and mixing uniformly according to the above proportions, the obtained mixture is melted and kneaded on a double-roller kneader preheated at a temperature of 70-100°C, and the melted and kneaded uniform material ...

Embodiment 2～8

[0049] The composition of the epoxy resin composition that can be stored at room temperature is shown in Table 1, the preparation method is the same as in Example 1, the evaluation method is the same as in Example 1, and the evaluation results are shown in Table 1.

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Abstract

The invention relates to an epoxy resin composition, in particular to a normal-temperature storage type epoxy resin composition capable of being stored at normal temperature and suitable for semiconductor packaging. The normal-temperature storage type epoxy resin composition for semiconductor packaging is obtained by using a special accelerant to match epoxy resin with phenolic resin, so that thenormal-temperature use time of the epoxy resin composition is greatly increased, the requirements on the process and the reliability of semiconductor packaging can be met, in particular, the requirement of the normal-temperature storage type epoxy resin composition can be met, and the normal-temperature storage type epoxy resin composition is a low-carbon environment-friendly material for semiconductor packaging. Meanwhile, the normal-temperature storage type epoxy resin composition has necessary flowability, filling property and flame resistance.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to a room temperature storage epoxy resin composition suitable for semiconductor packaging, which has room temperature storage performance, good molding process performance and reliability. Background technique [0002] In terms of application in the semiconductor industry, the epoxy resin composition used for packaging basically needs to be stored and transported at a low temperature below 5°C, and the use time after returning to temperature should not exceed 48 hours. Because the epoxy resin composition used for semiconductor encapsulation will undergo a slow self-crosslinking reaction at room temperature, the longer the time, the greater the crosslinking density, the gel is severe, and it cannot be used normally. Therefore, it needs to be stored and transported at a certain low temperature, and the use time at room temperature is within 48 hours. With the development trend of global...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L83/04C08L91/06C08K13/02C08K3/22C08K5/5435C08K3/04C08K3/36C08G59/68H01L23/29
CPCC08G59/686C08G59/688C08K2003/2227C08K2201/003C08L63/00C08L2201/02C08L2203/206C08L2205/025C08L2205/035H01L23/295C08L83/04C08L91/06C08K13/02C08K3/2279C08K3/36C08K3/22C08K5/5435C08K3/04
Inventor 李海亮李刚王善学卢绪奎
Owner 江苏科化新材料科技有限公司
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