Deep ultraviolet LED packaging structure and preparation method thereof

A technology of LED packaging and deep ultraviolet, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problem of detachment of the cover plate and the substrate, and achieve the effects of improving sealing, improving bonding force, and reducing light decay

Pending Publication Date: 2018-06-05
SHINEON BEIJING TECH
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  • Abstract
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Problems solved by technology

The deep ultraviolet LED packaging structure of the present invention solves the technical problem of the detachment of the cover plate and the substrate caused by

Method used

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  • Deep ultraviolet LED packaging structure and preparation method thereof
  • Deep ultraviolet LED packaging structure and preparation method thereof
  • Deep ultraviolet LED packaging structure and preparation method thereof

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Embodiment Construction

[0039] In order to illustrate the present invention more clearly, the present invention will be further described below in conjunction with preferred embodiments and accompanying drawings. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.

[0040] In one embodiment of the present invention, as figure 1 As shown, an ultraviolet LED packaging structure is provided, including a ceramic support 1 , an ultraviolet or deep ultraviolet LED chip 2 , quartz glass 3 and a metal coating 6 . The ceramic support 1 has a cup structure and is integrally formed with high thermal conductivity; the ultraviolet or deep ultraviolet LED chip 2 is mounted inside the ceramic support 1 by means of silver glue or soldering, and the ultraviolet or deep ultraviolet LED chip 2 The positive and negative poles are respectively fixed on the bottom surface of th...

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Abstract

The invention discloses a deep ultraviolet LED packaging structure and a preparation method thereof. The deep ultraviolet LED packaging structure comprises a ceramic bracket, a deep ultraviolet LED chip, quartz glass and a metal coating layer, wherein the ceramic bracket is of a bowl cup structure, and the deep ultraviolet LED chip is arranged in the ceramic bracket; the quartz glass is arranged at the upper end of the ceramic bracket, and a closed cavity is formed between the quartz glass and the ceramic bracket; and the outer surface of the closed cavity is coated with the metal coating layer and does not include the bottom surface of the closed cavity and the outer surface region, directly facing towards the inside of the closed cavity, of the quartz glass. The outer surface of the closed cavity is coated with the metal coating layer, so that the binding force and airtightness between the quartz glass and the ceramic bracket are improved, the problem that the quartz glass and the ceramic bracket are separated after the deep ultraviolet LED packaging structure works for a long time is solved, and the reliability of the deep ultraviolet LED packaging structure is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lighting. More specifically, it relates to a deep ultraviolet LED packaging structure and a preparation method thereof. Background technique [0002] With the advancement of LED packaging technology, LEDs in the deep ultraviolet band have gradually appeared on the market. In ultraviolet light, light with a wavelength of 200 nanometers to 280 nanometers is called deep ultraviolet light. Due to its advantages of high efficiency, environmental protection, energy saving and reliability, deep ultraviolet LED has great application value in the fields of lighting, sterilization, medical treatment, printing, biochemical detection, high-density information storage and confidential communication. LED can not match. [0003] Deep ultraviolet LEDs have extremely high requirements on packaging materials and packaging processes; using pure inorganic packaging methods such as solder paste or metal bondi...

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Application Information

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IPC IPC(8): H01L33/48H01L33/54H01L33/56
CPCH01L33/486H01L33/54H01L33/56H01L2933/005
Inventor 刘国旭熊志军
Owner SHINEON BEIJING TECH
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