The invention relates to the field of
mobile phone antenna preparation, in particular to a
mobile phone antenna surface metallization process. The
mobile phone antenna surface metallization process comprises the following steps of: S1, injection molding of a middle frame; S2, performing
laser etching treatment on a preset
laser etching area on the surface of the middle frame; S3, ultrasonically cleaning and
drying the
laser-etched middle frame S4, performing roughening treatment, neutralizing treatment,
water washing and
drying on the middle frame; S5, activating, reducing, washing and
drying the middle frame; S6, carrying out chemical
cobalt plating treatment on the middle frame to form a first
cobalt plating layer; S7, performing
copper plating treatment on the middle frame to form a
copper plating layer on the surface of the first
cobalt plating layer; S8, carrying out chemical cobalt plating treatment on the middle frame to form a second cobalt plating layer on the surface of the
copper plating layer; and S9, ultrasonically cleaning and drying the middle frame. The
mobile phone antenna surface metallization process has the advantages that the process is simple, the production efficiency of the middle frame is improved, the product quality is improved, the production cost of an enterprise is reduced, the bonding performance of the prepared
chemical plating layer and the middle frame is good, and a cobalt plating layer is originally adopted to replace an existing
nickel plating layer.