Mobile phone antenna surface metallization process

Abstract

The invention relates to the field of mobile phone antenna preparation, in particular to a mobile phone antenna surface metallization process. The mobile phone antenna surface metallization process comprises the following steps of: S1, injection molding of a middle frame; S2, performing laser etching treatment on a preset laser etching area on the surface of the middle frame; S3, ultrasonically cleaning and drying the laser-etched middle frame S4, performing roughening treatment, neutralizing treatment, water washing and drying on the middle frame; S5, activating, reducing, washing and drying the middle frame; S6, carrying out chemical cobalt plating treatment on the middle frame to form a first cobalt plating layer; S7, performing copper plating treatment on the middle frame to form a copper plating layer on the surface of the first cobalt plating layer; S8, carrying out chemical cobalt plating treatment on the middle frame to form a second cobalt plating layer on the surface of the copper plating layer; and S9, ultrasonically cleaning and drying the middle frame. The mobile phone antenna surface metallization process has the advantages that the process is simple, the production efficiency of the middle frame is improved, the product quality is improved, the production cost of an enterprise is reduced, the bonding performance of the prepared chemical plating layer and the middle frame is good, and a cobalt plating layer is originally adopted to replace an existing nickel plating layer.

Description

technical field [0001] The invention relates to the technical field of antenna manufacturing, in particular to a surface metallization process of a mobile phone antenna. Background technique [0002] In recent years, with the continuous development of the wireless communication industry and network upgrades, the frequency of wireless communication has become higher and higher, and the demand has increased. The structural design, material selection, manufacturing method and assembly process of the antenna are the guarantees of the reliability, stability and durability of the antenna performance. The middle frame is the most important functional component inside the antenna, and the general structure design is more complicated. The traditional middle frame manufacturing process is die-casting of metal materials (aluminum alloy or zinc alloy), or a combination of sheet metal parts, plastic fixing parts and circuits. [0003] At present, the mobile phone antenna, watch antenna...

AI Technical Summary

Problems solved by technology

[0003] At present, mobile phone antennas, watch antennas or plastic vibrators in the antenna industry have been introduced into the mass-produced LDS process. The main processes include: injection molding, mechanical roughening, ultrasonic cleaning, integral nickel plating on the surface of the middle frame body, and ra The surface of the frame body separates metallized and non-metallized areas that are insulated from each other, copper is plated on the metallized area, and nickel is stripped from the non-metallized area. Copper plating can only be done, and after copper plating, the nickel plating layer on the non-laser engraving area must be removed. The process is complex, time-consuming, inefficient, and inconvenient for product quality control. The problem of poor body bonding performance. At the same time, most of the formed nickel plating layer is layered, with high stress and poor bending resistance; many nickel plating solutions contain a variety of heavy metal ions, and the pollution is relatively large; the plating temperature needs to be It is carried out at high temperature, that is, the temperature needs to be above 80°C; the difference in the thickness of the nickel coating obtained by the existing method on the large and small copper surfaces can reach more than 25% at most, and the nickel coating is prone to be too thick or too thin; The nickel-plated layer formed is easy to cause color difference and even missed plating. In addition, the nickel-plated layer formed by the nickel-plating solution will release nickel within a certain period of time, which will cause allergies to the skin of some European and American white people, so there is a safety problem.