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Micro-nano double-stage porous copper and preparation method thereof

A micro-nano, porous copper technology, applied in the field of porous metal preparation, can solve the problems of complex preparation process, high requirements for precursor alloy phase composition, and no continuous ligaments formed by metal materials, etc., and achieve short preparation process and simple method Effect

Active Publication Date: 2018-06-12
XIAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese patent (publication number: 1068841909A) discloses a method of electrochemical oxidation or thermal oxidation in oxygen combined with electrochemical reduction to prepare hierarchical porous metal materials. The pore structure prepared by this method is composed of metal nanoparticles The formed primary pore aggregates are aggregated again and the secondary pore aggregates formed are connected to each other, but in essence, the two-level pore structure is formed by accumulation, and the metal material does not form a continuous ligament microscopically.
Chinese Patent (Publication No.: 105543531A) and Chinese Patent (Publication No.: 106591619A) respectively disclose methods for preparing two-stage porous copper materials by dealloying copper and aluminum alloys with NaOH and HCl. The requirements for phase composition are relatively high, and the preparation process is relatively complicated
However, the preparation of microporous metal materials by sintering and the preparation of nanoporous metal materials by dealloying have been developed to a relatively high degree in their respective fields, but the design of a material containing two pore structures of sintered micropores and dealloyed nanopores is scarce. There are reports

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  • Micro-nano double-stage porous copper and preparation method thereof

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preparation example Construction

[0022] The present invention also provides a method for preparing micro-nano dual-stage porous copper, comprising the following steps:

[0023] Step 1, mix Cu powder and Zn powder with a molar ratio of 3:7-5:5 evenly and press it into a billet, place it in a tube furnace and raise the temperature to 400-500°C under an argon atmosphere, keep it warm for 4-8 hours and then follow the furnace Cool to room temperature to obtain the precursor CuZn alloy;

[0024] In step 2, the precursor is placed in a 0.5 mol / L hydrochloric acid solution for dealloying until no obvious bubbles escape, and the micro-nano dual-stage porous copper can be prepared.

Embodiment 1

[0026] Mix Cu powder and Zn powder with a molar ratio of 3:7 evenly and press it into a billet, place it in a tube furnace under an argon atmosphere and raise the temperature to 400 °C, keep it warm for 4 hours, and then cool to room temperature with the furnace to obtain the precursor Cu 30 Zn 70 Alloy; then place the precursor in a 0.5mol / L hydrochloric acid solution for dealloying until no obvious bubbles escape, and prepare micro-nano dual-stage porous copper with an average pore diameter of 3.34 μm for micropores and 162 nm for nanopores.

Embodiment 2

[0028] Mix Cu powder and Zn powder with a molar ratio of 3:7 evenly and press it into a billet, place it in a tube furnace under an argon atmosphere and raise the temperature to 400 °C, keep it warm for 8 hours, and then cool to room temperature with the furnace to obtain the precursor Cu 30 Zn 70 Alloy; then place the precursor in 0.5mol / L hydrochloric acid solution for dealloying until no obvious bubbles escape, and prepare micro-nano dual-stage porous copper, with an average micropore diameter of 2.18 μm and an average nanopore diameter of 184 nm.

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Abstract

The invention discloses micro-nano double-stage porous copper. By using a sintered porous Cu framework as a substrate, double continuous micro-nano porous structures are formed on the substrate, wherein the average aperture of micro-holes is 2.18 microns to 3.68 microns, and the average aperture of nano-holes is 153nm to 234nm, so that organic combination of sintering preparation of the micro-holes and de-alloying preparation of the nano-holes in a copper matrix is realized, and the micro-nano double-stage porous copper has the characteristics of a micro-hole / nano-hole composite hole structureand a three-dimensional double continuous ligament / pore canal structure. A preparation method of the micro-nano double-stage porous copper comprises the following specific steps: 1, uniformly mixingpowder Cu with powder Zn in a certain proportion to obtain mixed powder and compressing the mixed powder into a blank, putting the blank into an atmosphere tube type furnace, heating the blank to a certain temperature, and cooling the blank to a room temperature after heat insulation is carried out for a certain time so as to obtain a precursor CuZn alloy; and 2, putting the precursor into a hydrochloric acid solution and performing de-alloying until air bubbles are not obviously effused so as to obtain the micro-nano double-stage porous copper. The preparation process of the micro-nano double-stage porous copper is simple and convenient, and is easy for realization.

Description

technical field [0001] The invention belongs to the technical field of porous metal preparation, and in particular relates to a micro-nano dual-stage porous copper; the invention also relates to a preparation method of the micro-nano dual-stage porous copper. Background technique [0002] Nanoporous metal materials have nanoscale pores and huge specific surface area, and their unique microstructure makes them have excellent physical and chemical properties, which can be applied in many fields such as catalysis, sensing and fuel cells. The precursor alloy is prepared by powder metallurgy, and the micron pores formed are conducive to the percolation and dealloying of corrosive liquid. The introduction of microporous structures can improve gas-liquid flow and ion exchange, which is expected to further enhance the catalytic sensing performance of nanoporous metals. The use of Zn as the second element can greatly reduce the sintering temperature of the precursor alloy, which is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/08C22C9/00C22C9/04C22C18/02C22C1/04
CPCB22F3/114C22C1/0425C22C1/0483C22C9/00C22C9/04C22C18/02
Inventor 杨卿马研孙少东梁淑华
Owner XIAN UNIV OF TECH
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