Aqueous putty and preparation method thereof
A putty, water-based technology, applied in the direction of filling slurry, etc., can solve the problems of biting bottom, slow drying, pungent odor of styrene, etc.
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Embodiment 1
[0044] A kind of water-based atomic putty, it comprises A component and B component that mass ratio is 5:1; Wherein, described A component comprises 30 parts of modified epoxy resins, 6 parts of reactive diluents, 2 parts of Environmentally friendly solvent, 0.6 parts of wetting and dispersing agent, 10 parts of pigment, 40 parts of filler, 2 parts of grinding aid and 0.6 part of anti-settling agent; B component contains 6 parts of water-based epoxy curing agent, the The water-based epoxy curing agent is a water-based cashew nut shell curing agent.
[0045] Preparation:
[0046] (1) Mix modified epoxy resin, reactive diluent, environmental solvent, wetting and dispersing agent, pigment, filler, grinding aid and anti-sedimentation agent, stir evenly at a speed of 400-600r / min, and slowly heat up to 70 -80℃, react for 1-2h, prepare A component;
[0047] (2) Stir the water-based epoxy curing agent and deionized water evenly at a speed of 200-400r / min to prepare component B; ...
Embodiment 2
[0050] A kind of water-based atomic putty, which comprises A component and B component with a mass ratio of 3:1; said A component comprises 20 parts of modified epoxy resin, 5 parts of octaacylphenyl cage type sesquioxide Alkane modified polyester / isophorone diisocyanate trimer, 2 parts of reactive diluent, 1 part of environmental solvent, 0.3 part of wetting and dispersing agent, 8 parts of pigment, 35 parts of filler, 1 part of Grinding aid and 0.1 part of anti-settling agent; component B contains 7 parts of water-based epoxy curing agent and 5 parts of polymethyl methacrylate microspheres;
[0051] Wherein, the modified epoxy resin comprises 3,3'-diethyl-4,4'-diaminodiphenylmethane modified epoxy resin; the water-based epoxy curing agent is a water-based cashew nut shell curing agent; the The polymethyl methacrylate microspheres use α-cyanoacrylate adhesive as the core and polymethyl methacrylate as the shell.
[0052] In the above scheme, the anti-settling agent is hydrop...
Embodiment 3
[0058] A kind of water-based atomic putty, it comprises A component and B component that mass ratio is 6:1; Said A component comprises 35 parts of modified epoxy resins, 10 parts of octaacylphenyl cage-type sesquioxides Alkane modified polyester / isophorone diisocyanate trimer, 8 parts of reactive diluent, 4 parts of environmentally friendly solvent, 1 part of wetting and dispersing agent, 15 parts of pigment, 55 parts of filler, 5 parts of Grinding aid and 1 part of anti-settling agent; component B contains 6 parts of water-based epoxy curing agent and 10 parts of polymethyl methacrylate microspheres;
[0059] Wherein, the modified epoxy resin comprises 3,3'-diethyl-4,4'-diaminodiphenylmethane modified epoxy resin; the water-based epoxy curing agent is a water-based cashew nut shell curing agent; the The polymethyl methacrylate microspheres use the α-cyanoacrylate adhesive as the core, and the polymethyl methacrylate as the shell.
[0060] In the above scheme, the anti-settli...
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