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Aqueous putty and preparation method thereof

A putty, water-based technology, applied in the direction of filling slurry, etc., can solve the problems of biting bottom, slow drying, pungent odor of styrene, etc.

Inactive Publication Date: 2018-06-15
HEBEI CHENYANG INDAL & TRADE GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, with the application of water-based coatings more and more widely, especially in the coating of construction machinery, railway locomotives, and buses, there are many deficiencies in the matching of traditional putty and water-based epoxy primers. Reason: Traditional putty contains a large amount of styrene. As a strong solvent, styrene is prone to bottoming when used in conjunction with water-based epoxy primers, and styrene has a strong pungent smell, which is harmful to the health of construction workers. Larger; and the water-based putty on the market cannot meet the existing construction process due to slow drying, and there is currently a lack of a quick-drying, environmentally friendly water-based putty that matches the water-based epoxy primer

Method used

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  • Aqueous putty and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A kind of water-based atomic putty, it comprises A component and B component that mass ratio is 5:1; Wherein, described A component comprises 30 parts of modified epoxy resins, 6 parts of reactive diluents, 2 parts of Environmentally friendly solvent, 0.6 parts of wetting and dispersing agent, 10 parts of pigment, 40 parts of filler, 2 parts of grinding aid and 0.6 part of anti-settling agent; B component contains 6 parts of water-based epoxy curing agent, the The water-based epoxy curing agent is a water-based cashew nut shell curing agent.

[0045] Preparation:

[0046] (1) Mix modified epoxy resin, reactive diluent, environmental solvent, wetting and dispersing agent, pigment, filler, grinding aid and anti-sedimentation agent, stir evenly at a speed of 400-600r / min, and slowly heat up to 70 -80℃, react for 1-2h, prepare A component;

[0047] (2) Stir the water-based epoxy curing agent and deionized water evenly at a speed of 200-400r / min to prepare component B; ...

Embodiment 2

[0050] A kind of water-based atomic putty, which comprises A component and B component with a mass ratio of 3:1; said A component comprises 20 parts of modified epoxy resin, 5 parts of octaacylphenyl cage type sesquioxide Alkane modified polyester / isophorone diisocyanate trimer, 2 parts of reactive diluent, 1 part of environmental solvent, 0.3 part of wetting and dispersing agent, 8 parts of pigment, 35 parts of filler, 1 part of Grinding aid and 0.1 part of anti-settling agent; component B contains 7 parts of water-based epoxy curing agent and 5 parts of polymethyl methacrylate microspheres;

[0051] Wherein, the modified epoxy resin comprises 3,3'-diethyl-4,4'-diaminodiphenylmethane modified epoxy resin; the water-based epoxy curing agent is a water-based cashew nut shell curing agent; the The polymethyl methacrylate microspheres use α-cyanoacrylate adhesive as the core and polymethyl methacrylate as the shell.

[0052] In the above scheme, the anti-settling agent is hydrop...

Embodiment 3

[0058] A kind of water-based atomic putty, it comprises A component and B component that mass ratio is 6:1; Said A component comprises 35 parts of modified epoxy resins, 10 parts of octaacylphenyl cage-type sesquioxides Alkane modified polyester / isophorone diisocyanate trimer, 8 parts of reactive diluent, 4 parts of environmentally friendly solvent, 1 part of wetting and dispersing agent, 15 parts of pigment, 55 parts of filler, 5 parts of Grinding aid and 1 part of anti-settling agent; component B contains 6 parts of water-based epoxy curing agent and 10 parts of polymethyl methacrylate microspheres;

[0059] Wherein, the modified epoxy resin comprises 3,3'-diethyl-4,4'-diaminodiphenylmethane modified epoxy resin; the water-based epoxy curing agent is a water-based cashew nut shell curing agent; the The polymethyl methacrylate microspheres use the α-cyanoacrylate adhesive as the core, and the polymethyl methacrylate as the shell.

[0060] In the above scheme, the anti-settli...

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Abstract

The invention provides aqueous putty and a preparation method thereof. The aqueous putty comprises a component A and a component B according to a mass ratio of (3-6): 1. The component A comprises 20 to 35 parts of a modified epoxy resin, 2 to 8 parts of a reactive diluent, 1 to 4 parts of an environmentally friendly solvent, 0.3 to 1 part of a wetting and dispersing agent, 8 to 15 parts of a pigment, 35 to 55 parts of a filler, 1 to 5 parts of a grinding auxiliary agent and 0.1 to 1 part of an anti-settling agent. The component B comprises 3 to 20 parts of a waterborne epoxy curing agent. Theaqueous putty has high matching with waterborne epoxy primer and has the characteristics of fast curing rate, good adhesion and excellent mechanical properties.

Description

technical field [0001] The present invention generally relates to the field of coatings, and in particular, to water-based putty and a preparation method thereof. Background technique [0002] At present, the traditional putty on the market is mainly based on unsaturated polyester putty, which is divided into two components, A and B. The A component is mainly composed of unsaturated polyester resin, styrene, additives and various fillers, and the B component Generally initiators and plasticizers. In recent years, with the application of water-based coatings more and more widely, especially in the coating of construction machinery, railway locomotives, and buses, there are many deficiencies in the matching of traditional putty and water-based epoxy primers. Reason: Traditional putty contains a large amount of styrene. As a strong solvent, styrene is prone to bottoming when used in conjunction with water-based epoxy primers, and styrene has a strong pungent smell, which is ha...

Claims

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Application Information

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IPC IPC(8): C09D5/34
Inventor 王瑞宏郭晓峰郭晓猛胡中源
Owner HEBEI CHENYANG INDAL & TRADE GROUP CO LTD