Double-chip sweat sensor and preparation method thereof
A sensor and dual-chip technology, applied in the field of sensors, can solve problems such as reduced antibody regulation ability, muscle spasm, dehydration, even coma, and hypersensitivity to visual and auditory stimuli
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Embodiment 1
[0076] see figure 1 .
[0077] A double-chip sweat sensor, comprising a carrier board 1, a signal processing chip 2 and an electrode chip 3 are arranged on the carrier board 1, and the electrode chip 3 is provided with a working electrode 31, a reference electrode 32 and an external connection pad 33, and the external connection welding The disc 33 includes a working electrode external connection pad and a reference electrode external connection pad, the working electrode 31 is connected to the working electrode external connection pad through a conductive line, and the reference electrode 32 is connected to the reference electrode external connection pad through a conductive line;
[0078] The pads on the external connection pad 33 and the signal processing chip 2 pass through the wire bonding process (the wire bonding wire connects the pads of the working electrode external connection pad 33 and the signal processing chip 2, and the connection between the signal processing c...
Embodiment 2
[0102] see figure 2 .
[0103] A double-chip sweat sensor, comprising a carrier board 1, a signal processing chip 2 and an electrode chip 3 are arranged on the carrier board 1, and the electrode chip 3 is provided with a working electrode 31, a reference electrode 32 and an external connection pad 33, and the external connection welding The disc 33 includes a working electrode external connection pad and a reference electrode external connection pad, the working electrode 31 is connected to the working electrode external connection pad through a conductive line, and the reference electrode 32 is connected to the reference electrode external connection pad through a conductive line;
[0104] The external pad 33 is connected to the pad on the signal processing chip 2 through a wire bonding process, and the other pad on the signal processing chip 2 is connected to the pad on the carrier board 1 through a wire bonding process;
[0105] The electrode chip 3 and the signal process...
Embodiment 3
[0111] see image 3 .
[0112] A double-chip sweat sensor, comprising a carrier board 1, a signal processing chip 2 and an electrode chip 3 are arranged on the carrier board 1, and the electrode chip 3 is provided with a working electrode 31, a reference electrode 32 and an external connection pad 33, and the external connection welding The disc 33 includes a working electrode external connection pad and a reference electrode external connection pad, the working electrode 31 is connected to the working electrode external connection pad through a conductive line, and the reference electrode 32 is connected to the reference electrode external connection pad through a conductive line;
[0113] The external pad 33 is connected to the pad on the signal processing chip 2 through a wire bonding process, and the other pad on the signal processing chip 2 is connected to the pad on the carrier board 1 through a wire bonding process;
[0114] The electrode chip 3 and the signal processi...
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