Polishing process for ultrathin sapphire wafers

A sapphire wafer and process technology, which is applied to surface polishing machine tools, grinding/polishing equipment, manufacturing tools, etc., can solve the problems of inability to meet the polishing requirements of sapphire wafers, long polishing time for polished sapphire wafers, etc., and achieve stable and reliable polishing quality. , The effect of shortening polishing time and reducing production cost

Active Publication Date: 2018-06-29
LENS TECH CHANGSHA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using this polishing method to polish sapphire wafers takes a long time to polish, and the thickness of the sapphire wafers polished by this method is above 0.25 mm, which cannot meet the polishing requirements of sapphire wafers with a thickness less than 0.25 mm.

Method used

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  • Polishing process for ultrathin sapphire wafers
  • Polishing process for ultrathin sapphire wafers

Examples

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Embodiment Construction

[0021] The present invention will be described in detail below through specific examples, but the present invention can be implemented in many different ways defined and covered by the claims.

[0022] A kind of polishing process of ultra-thin sapphire wafer of the present invention, the thickness of the product after ultra-thin sapphire wafer polishing is 0.1~0.2mm, it is characterized in that, polishing process comprises the following steps: 1), the sapphire wafer obtained by cutting is grouped by thickness , so that the thickness difference of multiple sapphire wafers in the same group is within 0.015mm; 2), rough throwing preparation stage: provide an adsorption pad, which is provided with a plurality of cavity holes for placing sapphire wafers, the cavity holes The depth is lower than the thickness of the sapphire wafer after the rough polishing step. Wet the cavity hole with clean water, and then put the sapphire wafer into the cavity hole so that the two are relatively f...

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Abstract

The invention provides a polishing process for ultrathin sapphire wafers. The polishing process comprises the following steps of 1, grouping the sapphire wafers obtained after cutting according to thethickness; 2, providing an adsorption pad provided with multiple cavity holes used for containing the sapphire wafers, wetting the cavity holes with clear water, putting the sapphire wafers into thecavity holes, and making each sapphire wafer and the corresponding cavity hole be fixed relative to each other; 3, putting the adsorption pad on a copper disc of a polishing machine with openings of the cavity holes of the adsorption pad facing downwards, so that rough polishing is conducted on the sapphire wafers; and 4, putting the sapphire wafers obtained after rough polishing on a lower polishing disc of a double-face polishing machine for finish polishing. By means of the polishing process for the ultrathin sapphire wafers, the polishing time is greatly shortened, polishing efficiency isimproved, and production cost is lowered; the thickness of each sapphire wafer obtained after polishing is small and can reach 0.1-0.2 mm; polishing quality is stable and reliable; and the polishing process meets the trend that existing sapphire products develop to be lighter and thinner.

Description

technical field [0001] The invention relates to the technical field of sapphire wafer processing, in particular to a polishing process for an ultra-thin sapphire wafer. Background technique [0002] Sapphire is a multifunctional oxide crystal integrating excellent optical properties, physical properties and chemical properties. Its hardness is second only to diamond and reaches Mohs 9. It has the characteristics of wear resistance, high temperature resistance, corrosion resistance and high melting point. The above Features are very suitable for window screens of mobile phones, watches, cameras and other products. In order to meet the above-mentioned requirements for the development of sapphire optical devices and obtain a high-level, high-brightness surface, chemical-mechanical polishing must be performed on sapphire products to reduce or eliminate scratches on products during cutting and grinding processes and obtain high-level flatness High-degree, high-brightness product...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B41/06
CPCB24B29/02B24B41/06
Inventor 周群飞饶桥兵梁成华
Owner LENS TECH CHANGSHA
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