Polishing process for ultrathin sapphire wafers

Abstract

The invention provides a polishing process for ultrathin sapphire wafers. The polishing process comprises the following steps of 1, grouping the sapphire wafers obtained after cutting according to thethickness; 2, providing an adsorption pad provided with multiple cavity holes used for containing the sapphire wafers, wetting the cavity holes with clear water, putting the sapphire wafers into thecavity holes, and making each sapphire wafer and the corresponding cavity hole be fixed relative to each other; 3, putting the adsorption pad on a copper disc of a polishing machine with openings of the cavity holes of the adsorption pad facing downwards, so that rough polishing is conducted on the sapphire wafers; and 4, putting the sapphire wafers obtained after rough polishing on a lower polishing disc of a double-face polishing machine for finish polishing. By means of the polishing process for the ultrathin sapphire wafers, the polishing time is greatly shortened, polishing efficiency isimproved, and production cost is lowered; the thickness of each sapphire wafer obtained after polishing is small and can reach 0.1-0.2 mm; polishing quality is stable and reliable; and the polishing process meets the trend that existing sapphire products develop to be lighter and thinner.

Description

technical field [0001] The invention relates to the technical field of sapphire wafer processing, in particular to a polishing process for an ultra-thin sapphire wafer. Background technique [0002] Sapphire is a multifunctional oxide crystal integrating excellent optical properties, physical properties and chemical properties. Its hardness is second only to diamond and reaches Mohs 9. It has the characteristics of wear resistance, high temperature resistance, corrosion resistance and high melting point. The above Features are very suitable for window screens of mobile phones, watches, cameras and other products. In order to meet the above-mentioned requirements for the development of sapphire optical devices and obtain a high-level, high-brightness surface, chemical-mechanical polishing must be performed on sapphire products to reduce or eliminate scratches on products during cutting and grinding processes and obtain high-level flatness High-degree, high-brightness product...

AI Technical Summary

Problems solved by technology

Using this polishing method to polish sapphire wafers takes a long time to polish, and the thickness of the sapphire wafers polished by this method is above 0.25 mm, which cannot meet the polishing requirements of sapphire wafers with a thickness less than 0.25 mm.

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