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Airtight metal-ceramic housing applied to 60 GHz

A ceramic shell, airtight technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as large insertion loss, achieve low insertion loss, large power capacity, and achieve the effect of airtight packaging

Active Publication Date: 2018-06-29
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention proposes a metal-ceramic housing and design method applied to 60GHz, and its purpose is to overcome the problem of excessive insertion loss of the current housing due to dispersion, resonance and other reasons in the millimeter wave frequency band

Method used

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  • Airtight metal-ceramic housing applied to 60 GHz
  • Airtight metal-ceramic housing applied to 60 GHz
  • Airtight metal-ceramic housing applied to 60 GHz

Examples

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Embodiment 1

[0032] An airtight metal-ceramic casing applied to 60GHz. The casing is composed of a metal heat sink, a metal frame and a ceramic insulator. The RF transmission channel of the casing adopts a rectangular waveguide-microstrip line transition structure, specifically: through the metal heat sink Make a rectangular hole on the top to form a vertical rectangular waveguide, and open a groove on the long side of the rectangular waveguide, solder the ceramic insulator in the groove of the rectangular waveguide through solder, and then weld the frame and the heat sink, on the top of the rectangular waveguide form a short circuit. Among them, the ceramic insulator is a microstrip-stripline-microstrip structure. The microstrip line on one side acts as a probe to excite the required transmission mode in the rectangular waveguide, and the microstrip line on the other side acts as a probe. It is used to interconnect with the chip, and the role of the middle strip line is to achieve airtigh...

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Abstract

The invention relates to an airtight metal-ceramic housing applied to 60 GHz. The airtight metal-ceramic housing structurally comprises a metal heat sink, a metal frame and ceramic insulators, whereinfour screw fixing holes and two rectangular waveguides in a vertical direction are designed on the metal heat sink; one open slot is formed in each long side of the rectangular waveguides; the ceramic insulators are embedded in the open slots of the rectangular waveguides; the metal frame is connected with the metal heat sink to form a housing for encapsulating a 60 GHz chip; a high-frequency signal transmission channel adopts awaveguide-microstrip transition structure for converting TE waves of the rectangular waveguides into quasi-TEM waves of a microstrip line, so that signals are transmitted from an external circuit to the chip in the housing. The airtight metal-ceramic housing provided by the invention has advantages that the housing adopts the rectangular waveguides as input and output ports so as to be more conveniently interconnected with the external circuit and realize low inserting loss and high power capacity; the ceramic insulator adopts a ceramic-metal-ceramic structure,which not only can play a role of waveguide-microstrip conversion, but also can realize airtight encapsulation.

Description

technical field [0001] The invention relates to a 60GHz airtight metal-ceramic casing, which belongs to the field of chip packaging. Background technique [0002] With the development of 5G communication, satellite communication and other technologies, there are more and more millimeter wave chips. [0003] What follows is that the demand for millimeter-wave housings is also increasing. However, due to dispersion, resonance and other reasons, the RF transmission structure of traditional microwave housings has too large insertion loss in the millimeter-wave frequency band, which cannot meet the requirements of packaged chips. Therefore, for millimeter wave chips, bare chip packaging technology is mostly used now, but this method cannot meet the high reliability requirements of aviation and aerospace. Contents of the invention [0004] The present invention proposes a metal-ceramic housing and a design method for 60GHz, and its purpose is to overcome the problem of excessiv...

Claims

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Application Information

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IPC IPC(8): H01L23/552
CPCH01L23/552
Inventor 李永彬施梦侨程凯
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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