A solid-state laser cooling heat sink
A solid-state laser and heat sink technology, applied in the field of optoelectronics, can solve the problem of not greatly improving the cooling efficiency of high-power lasers, and achieve the effects of improving cooling efficiency, strengthening mixing and disturbance, and increasing heat exchange area
Active Publication Date: 2020-03-27
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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Problems solved by technology
[0006] The invention provides a cooling heat sink for solid-state lasers, which is used to solve the problem that the parallel groove-like or pin-rib micro-channel heat sinks with the simplest structure are widely used in the prior art high-power laser cooling schemes, and there is no better way to The problem of greatly improving the cooling efficiency of high power lasers
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[0033] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0034] See figure 1 , figure 2 , in the first embodiment of the present invention, a solid-state laser cooling heat sink is provided, including a cover 1 and a heat sink base 4, and a columnar protrusion array is distributed on the heat sink base 4; There is an elastic heat exchange mechanism, and the elastic heat exchange mechanism vibrates under the action of the flow of the cooling medium, and the cover 1 and the heat sink bas...
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Abstract
The invention discloses a solid laser cooling heatsink. The solid laser cooling heatsink comprises an enclosed cover and a heatsink substrate, wherein a column-shaped bump array is distributed on theheatsink substrate; an elastic heat-exchanging mechanism is arranged on the column-shaped bump array; the elastic heat-exchanging mechanism generates vibration under the flowing action of a cooling medium; the enclosed cover and the heatsink substrate are enclosed to form the cooling heatsink. The heatsink substrate is provided with the column-shaped bump array, the internal heat-exchanging area of the heatsink is increased effectively, a special porous metal fiber-mesh is arranged in the internal elastic heat-exchanging mechanism of the heatsink, so that the heat-exchanging effect is enhanced; meanwhile, metal wire spring coils are arranged in the elastic heat-exchanging mechanism, so that the equivalent heat conductive coefficient of the cooling medium is increased, internal mixing and disturbance of the fluid are enhanced; the defect that the heat-exchanging coefficient of the back region of each conventional column-shaped bump is remarkably lower than that of a fluid-facing area iseliminated; the heat-exchanging efficiency of the heatsink is increased further, and the cooling efficiency is increased greatly.
Description
technical field [0001] The invention relates to the field of optoelectronic technology, in particular to a solid laser cooling heat sink. Background technique [0002] In a high-power solid-state laser system, only part of the pump light absorbed by the laser gain medium is converted into laser output, and most of the rest is converted into waste heat and deposited inside the gain medium, forming a non-uniform heat distribution. Taking a solid-state laser as an example, the pump light is absorbed and attenuated exponentially when it is transmitted in the gain medium, so the heat source distribution along the length of the slab is approximately a flat "V" shape. Since the solid gain medium can only rely on the cooling of the non-pumped outer surface to take away the heat, the internal heat generation and the cooling of the outer surface will inevitably form a temperature gradient inside the gain medium, and the corresponding thermal stress and strain and the refractive index ...
Claims
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IPC IPC(8): H01S3/04H01S3/042
CPCH01S3/0405H01S3/0407H01S3/042
Inventor 吕坤鹏杨雪唐晓军赵鸿刘磊王超梁兴波刘洋王文涛陈露
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP