Cooling system based on slab laser

Abstract

The invention discloses a cooling system based on a slab laser. The cooling system performs directional conductive water-cooling-free heat dissipation on the basis of crystal shape of the slab laser,and comprises a neodymium-doped yttrium vanadate crystal, highly thermal conductive heat sinks and electronic borneol, wherein the neodymium-doped yttrium vanadate crystal is a pumping source of the laser; the highly thermal conductive heat sinks are arranged on two sides of the neodymium-doped yttrium vanadate crystal; the electronic borneol is arranged on outer sides of the highly thermal conductive heat sinks. Heat produced by the neodymium-doped yttrium vanadate crystal is transmitted to the bottom surface of metal indium from the top surface, then is transmitted to a base and a housing ofthe laser through the electronic borneol and thermal conductive copper pipes and is finally input into a work environment. According to the scheme, a water-cooling-free manner is adopted, the heat isdissipated in a directional transmission manner through thermal conduction, the overall length of the length is reduced greatly, and the laser is more flexible and can be used under conditions with difficulties in water cooling such as weightlessness and the like.

Description

technical field [0001] The invention relates to the field of laser technology and the field of electronic technology, in particular to a thermal control of a small-volume, high-power-density heat concentration device using an electronic ice sheet heat dissipation system. Background technique [0002] Lasers or electronic chips have been widely used in the fields of material processing and medical treatment, and are developing rapidly towards high integration and high power. Therefore, the heat dissipation problem of high heat flux generated by it has become increasingly serious, and has become a bottleneck in the development of today's industrial integration. At present, heat concentrating devices with high power density mainly use water cooling to dissipate heat. However, due to the bulky and difficult transportation of conventional water-cooled heat dissipation methods, there are great restrictions on the military applications of high-power solid-state lasers on vehicle, ...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem that high-power semiconductor lasers in the prior art use water cooling to dissipate heat, the whole machine has a large volume and cannot work under weightless conditions, and provides a small-volume high-power semiconductor laser that uses a heat pipe cooling system to dissipate heat

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