Cooling system based on slab laser

A technology of slab laser and heat dissipation system, applied in the field of lasers, can solve the problems of inability to work under weightless conditions, large size of the whole machine, etc., and achieve the effects of reducing thermal lens effect, flexible laser, and reducing overall length

Inactive Publication Date: 2018-06-29
BEIJING UNIV OF TECH
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Problems solved by technology

[0004] In order to solve the problem that high-power semiconductor lasers in the prior art use water cooling to dissipate heat, the whole machine has a large volume and cannot work under weightless conditions, and provides a small-volume high-power semiconductor laser that uses a heat pipe cooling system to dissipate heat

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  • Cooling system based on slab laser
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Embodiment Construction

[0018] Such as Figure 1-2 As shown, the present invention provides a slab-type laser-based electronic ice sheet heat dissipation system, including: Nd:YAG crystal, mirror group, high thermal conductivity heat sink, and tec chip. In order to reduce the thermal contact resistance between the thermal interfaces, it needs to be controlled from multiple aspects and multiple means. The specific implementation methods are:

[0019] The upper and lower sides of the Nd:YAG crystal are respectively combined with high thermal conductivity heat sinks, and a heat conduction pad is used between the high heat conduction heat sinks to avoid damage. The thickness of the heat conduction pad is 0.2-0.5mm;

[0020] The surface morphology and dimensional accuracy control of the thermal interface, here controls the accuracy of the upper and lower surfaces of the heat sink, generally speaking, the roughness should be less than 1.6, and the flatness should be less than 0.1mm / 100mm×100mm. The surfac...

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Abstract

The invention discloses a cooling system based on a slab laser. The cooling system performs directional conductive water-cooling-free heat dissipation on the basis of crystal shape of the slab laser,and comprises a neodymium-doped yttrium vanadate crystal, highly thermal conductive heat sinks and electronic borneol, wherein the neodymium-doped yttrium vanadate crystal is a pumping source of the laser; the highly thermal conductive heat sinks are arranged on two sides of the neodymium-doped yttrium vanadate crystal; the electronic borneol is arranged on outer sides of the highly thermal conductive heat sinks. Heat produced by the neodymium-doped yttrium vanadate crystal is transmitted to the bottom surface of metal indium from the top surface, then is transmitted to a base and a housing ofthe laser through the electronic borneol and thermal conductive copper pipes and is finally input into a work environment. According to the scheme, a water-cooling-free manner is adopted, the heat isdissipated in a directional transmission manner through thermal conduction, the overall length of the length is reduced greatly, and the laser is more flexible and can be used under conditions with difficulties in water cooling such as weightlessness and the like.

Description

technical field [0001] The invention relates to the field of laser technology and the field of electronic technology, in particular to a thermal control of a small-volume, high-power-density heat concentration device using an electronic ice sheet heat dissipation system. Background technique [0002] Lasers or electronic chips have been widely used in the fields of material processing and medical treatment, and are developing rapidly towards high integration and high power. Therefore, the heat dissipation problem of high heat flux generated by it has become increasingly serious, and has become a bottleneck in the development of today's industrial integration. At present, heat concentrating devices with high power density mainly use water cooling to dissipate heat. However, due to the bulky and difficult transportation of conventional water-cooled heat dissipation methods, there are great restrictions on the military applications of high-power solid-state lasers on vehicle, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S3/04H01S3/042H01S3/0941H01S3/16
CPCH01S3/0405H01S3/042H01S3/0941H01S3/1611H01S3/1673
Inventor 王旭葆王宏超邓培张洪曼
Owner BEIJING UNIV OF TECH
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