System for thermostatically preparing low-melting point alloy and quantitatively filling and application method thereof

A quantitative filling and low melting point technology, applied in the direction of manufacturing tools, casting equipment, metal processing equipment, etc., can solve the problems of cumbersome procedures and difficult operation of liquid low melting point alloys, achieve light weight, improve heating efficiency, and reduce volume Effect

Pending Publication Date: 2018-07-06
XIJING UNIV
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  • Description
  • Claims
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Problems solved by technology

Obviously, the process of preparing liquid low-melting point alloys through the hot bath method is relatively cumbersome, and the prepared liquid low-melting point alloys are inject

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  • System for thermostatically preparing low-melting point alloy and quantitatively filling and application method thereof

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Embodiment Construction

[0058] The present invention will be further described in detail below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0059] Such as figure 1 As shown, a constant temperature preparation of low melting point alloy and quantitative filling system, including constant temperature preparation module 100, quantitative filling module 200 and control module 300; constant temperature preparation module 100 is used to prepare liquid low melting point alloy 101 and keep the temperature constant, quantitative The filling module 200 can use the liquid low-melting point alloy 101 produced by the constant temperature preparation module 100 as the raw material according to the set volume filling value input by the user to realize quantitative filling. The liquid low-melting-point alloy 101 and the quantitative filling module 200 add the quantitative volum...

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Abstract

The invention discloses a system for thermostatically preparing low-melting point alloy and quantitatively filling and an application method thereof. The system comprises a thermostatic preparation module, a quantitative filling module, and a control module; the thermostatic preparation module is used for preparing liquid-state low-melting point alloy and maintaining the temperature constancy; thequantitative filling module can realize quantitative filling by taking the liquid-state low-melting point alloy prepared by the thermostatic preparation module as a raw material according to a set volume filling value input by a user; the control module respectively controls the processes of preparing the thermostatic liquid-state low-melting point alloy by the thermostatic preparation module andfilling the liquid-state low-melting point alloy with quantitative volume by the quantitative filling module. The system has the features of being small in volume and convenient for carrying, and iscapable of realizing thermostatic preparation and quantitative filling, and suitable for preparing at construction field and filling the liquid-state low-melting point alloy.

Description

technical field [0001] The invention belongs to the technical field of low-melting-point alloys, and in particular relates to a system for constant-temperature preparation of low-melting-point alloys and a quantitative filling system and an application method thereof. Background technique [0002] Low melting point alloys refer to binary, ternary or quaternary fusible alloys composed of bismuth (Bi), tin (Sn), lead (Pb), indium (In) and other low melting point metal elements in different proportions. Below 232°C (the melting point of tin). Low melting point alloys have low vapor pressure, are easy to process, have good thermal conductivity, high fluidity, reusability, and dimensional controllability during solidification. Based on the above characteristics, in the field of mechanical processing, low-melting point alloys are used as inner and outer fillers for thin-walled elbows and precision parts processing; in the field of mold manufacturing, they are used for casting mol...

Claims

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Application Information

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IPC IPC(8): C22C1/02B22D39/02
CPCC22C1/02B22D39/003B22D39/02
Inventor 张毅蔺国旗李勇兴李沪苏鹏升
Owner XIJING UNIV
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