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Chip module with excellent heat dissipation performance and fabrication method of chip module

A heat dissipation and chip technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, semiconductor devices, etc., can solve the problem of heat dissipation reduction, achieve less voids, good welding effect, and meet the requirements of size and cost.

Inactive Publication Date: 2018-07-13
SUZHOU TF AMD SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the volatilized gas of the flux will displace the liquid indium and flow around the chip, and a large number of voids will be formed between the chip and the heat dissipation cover, resulting in a decrease in heat dissipation

Method used

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  • Chip module with excellent heat dissipation performance and fabrication method of chip module
  • Chip module with excellent heat dissipation performance and fabrication method of chip module
  • Chip module with excellent heat dissipation performance and fabrication method of chip module

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Embodiment Construction

[0028] The technical solution of the present invention is specifically described below in conjunction with the embodiments. The present invention discloses a chip assembly with good heat dissipation, combined with Figure 1-Figure 3 As shown, the chip assembly is similar to the prior art, and both include a chip body 3 connected to the substrate 1 through solder balls 2, a heat-dissipating indium sheet 4 is arranged above the chip body 3 and packaged on the heat-dissipating indium sheet 4 6 on the heat sink cover.

[0029] Different from the prior art, a dam 5 is arranged around the chip body 3, and a gap is provided between the dam 5 and the chip body 3, and the gap between the dam 5 and the heat dissipation chip is 0-2000μm. The dam 5 can be constructed by using materials such as epoxy resin glue and organic silicon through a glue dispenser, a sprayer or a 3D printer.

[0030] The dam in the present invention refers to a protective ring formed around the chip around the ch...

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Abstract

The invention provides a chip module with excellent heat dissipation performance and a fabrication method of the chip module. The chip module comprises a chip body, wherein the chip body is connectedto a substrate by a welding ball, a dam is arranged around the chip body, a gap is formed between the dam and the chip body, a cooling indium sheet and a cooling cover are arranged above the chip body, the cooling cover is packaged on the cooling indium sheet. By arranging a dam structure around the chip body, the dosage of an additive during the fabrication process of the chip module is more stable, fewer holes are generated after welding, the liquid indium is smaller in mobility under a high temperature, the welding effect is better, and the final cooling effect of the chip module is more excellent.

Description

technical field [0001] The invention belongs to the technical field of chip heat dissipation, and in particular relates to a chip component with good heat dissipation and a preparation method thereof. Background technique [0002] With the development of the microelectronics industry towards lightweight, thinner, miniaturized and functional diversification, the traditional wire bonding interconnection technology can no longer meet the high-density requirements, and flip-chip packaging technology has emerged under such circumstances . Packaging technology and packaging materials are the two most important factors affecting the reliability of electronic packaging, and they promote and restrict each other. [0003] In the semiconductor industry, high heat dissipation needs to be considered when packaging high-end processors. The existing flip-chip packaging technology is to directly connect the bare chip to the organic substrate through solder balls. At the same time, the un...

Claims

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Application Information

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IPC IPC(8): H01L23/13H01L23/367H01L23/373H01L21/48
CPCH01L2224/73253H01L23/3672H01L21/4803H01L21/4882H01L23/13H01L23/3736
Inventor 陈传兴邱原
Owner SUZHOU TF AMD SEMICON CO LTD
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