Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A printed circuit board, a method for manufacturing a printed circuit board, and a mobile terminal

A printed circuit board and conductive layer technology, which is applied to printed circuits connected to non-printed electrical components, printed circuit manufacturing, printed circuits, etc., can solve problems such as loss, affecting thickness, failure impedance and so on, to increase safety The effect of gap, reducing impedance and loss, and improving the ability to resist external static pressure

Active Publication Date: 2019-10-15
VIVO MOBILE COMM CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Embodiments of the present invention provide a printed circuit board, a method for manufacturing a printed circuit board, and a mobile terminal, so as to solve the problem that the internal structure setting of the mobile terminal in the prior art affects the thickness, it is easy to cause failure in the static pressure scene, and additional vias are added Bringing the problem of impedance and loss

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A printed circuit board, a method for manufacturing a printed circuit board, and a mobile terminal
  • A printed circuit board, a method for manufacturing a printed circuit board, and a mobile terminal
  • A printed circuit board, a method for manufacturing a printed circuit board, and a mobile terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0024] The embodiment of the present invention provides a printed circuit board, such as figure 1 , figure 2 , image 3 with Figure 4 Shown, including:

[0025] PCB board body 1, the first surface of the PCB board body 1 is provided with a groove 11; PCB device 2, the PCB device 2 includes a connecting terminal 21, a part of the PCB device 2 is located in the groove 11, and the connecting terminal 21 includes a groove located in the groove 11 The first part 21...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a printed circuit board, a method for manufacturing the printed circuit board, and a mobile terminal. The printed circuit board includes a PCB board body, and a groove is arranged on the first surface of the PCB board body; a PCB device, and the PCB device includes A connection terminal, a part of the PCB device is located in the groove, the connection terminal includes a first part located in the groove and a second part located outside the groove, and the first part is electrically connected to the conductive layer in the PCB board body. The above structure can reduce the height of the device protruding from the surface of the PCB board body, thereby reducing the height of the assembled structure formed after the printed circuit board and the electronic device are assembled, and can also increase the distance between the device body and the shield body under the premise of the same height. The safety gap improves the ability of the assembly structure to resist external static pressure. At the same time, the PCB device is electrically connected to at least two conductive layers in the PCB body, which can reduce the setting of vias, thereby reducing the impedance and loss caused by vias.

Description

Technical field [0001] The invention relates to the technical field of electronic products, in particular to a printed circuit board, a manufacturing method of the printed circuit board and a mobile terminal. Background technique [0002] Thinning is a current development direction of mobile terminals. However, with the diversification of functions implemented by mobile terminals and the continuous improvement of equipment performance requirements, more and more power management modules will be used in the development of mobile terminals. For example, the charging circuit, the power supply network of the main chip, the driving circuit of the display screen and so on. In these power management modules, most of them have adopted a switching power supply implementation. In a switching power supply, the size of the components that need to be used are relatively large, such as power inductors. [0003] At the same time, due to the switching noise of the switching power supply, the po...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18
CPCH05K1/183H05K2201/09036H05K2201/10636Y02P70/50H05K3/0026H05K3/3485H05K3/3494H05K1/0298H05K1/115H05K3/30H05K3/4038H05K2201/09518H05K2203/1453
Inventor 唐后勋
Owner VIVO MOBILE COMM CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products