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Novel electroplating solution

An electroplating solution and a new type of technology, applied in the field of new electroplating solution for nickel plating and electroplating solution, can solve the problems of easy falling off of the coating layer and easy generation of pinholes in the coating layer, and achieve the effect of strong bonding ability

Inactive Publication Date: 2018-07-24
CHENGDU LIANLIDA HARDWARE PROD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although it is widely used, there are still many defects that are difficult to overcome in the existing nickel plating technology, including the phenomenon that the coating is easy to fall off, and the coating is prone to pinholes.

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0012] A new type of electroplating solution, which includes the following components: nickel sulfate, nickel chloride, sodium chloride, magnesium sulfate, boric acid, sodium sulfate, sodium citrate, sodium carboxymethylcellulose (CMC), ethylene glycol, octane Sodium Hydroxyl Sulfate and Water.

[0013] Preferably: the novel electroplating solution comprises the following components: the novel electroplating solution comprises the following components: nickel sulfate 250~350g / L, nickel chloride 25~50g / L, sodium chloride 5~10g / L, Magnesium sulfate 3~5g / L, boric acid 40~50g / L, sodium sulfate 40~60g / L, sodium citrate 5~12g / L, sodium carboxymethylcellulose (CMC) 5~15g / L, ethylene glycol 10~20g / L, sodium octyl sulfate 3~10g / L and water.

[0014] It is also preferred that the novel electroplating solution also includes the component 2-ethylhexyl sodium sulfate.

[0015] Further preferably: the content of 2-ethylhexyl sodium sulfate in the novel electroplating solution is 5-10 g / L....

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PUM

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Abstract

The invention discloses a novel electroplating solution. The novel electroplating solution is prepared from the following components: nickel sulfate, nickel chloride, sodium chloride, magnesium sulfate, boric acid, sodium sulfate, sodium citrate, sodium carboxymethyl cellulose (CMC), ethylene glycol, sodium octyl sulfate and water. According to the novel electroplating solution provided by the invention, a more dense and compact dark nickel plating layer can be obtained and a bonding capability of the plating layer and a plated metal surface is strong; phenomenon of peeling, falling and pinholes and the like do not occur.

Description

technical field [0001] The invention relates to the technical field of electroplating solutions, in particular to the technical field of novel electroplating solutions for nickel plating. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis. Through electroplating, a protective layer can be formed on the surface of the metal to be plated, thereby enhancing the oxidation resistance and corrosion resistance of the metal surface to be plated. abrasion resistance. [0003] Nickel plating is a common electroplating method, which is widely used in automobiles, bicycles, watches, medical equipment, instruments and daily hardware, etc. Although it is widely used, there are still many defects that are difficult to overcome in the existing nickel plating technology, including the phenomenon that the coating is easy to fall off, and the coating is prone to pinh...

Claims

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Application Information

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IPC IPC(8): C25D3/12
CPCC25D3/12
Inventor 姚小林
Owner CHENGDU LIANLIDA HARDWARE PROD
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