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Copper-based tin-plated high-temperature resisting protective agent

A technology of high temperature resistance and protective agent, which is applied in the field of high temperature resistant protective agent for copper-based tin plating. It can solve problems that affect product reliability, poor welding, discoloration, etc., and achieve improved tin high temperature oxidation resistance, simple configuration, and convenient operation. Effect

Inactive Publication Date: 2018-07-24
SHENZHEN SHENGYUAN SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the soldering process, there will be abnormalities such as melting tin, discoloration, and poor soldering, which directly affect product reliability.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment 1, comprises according to the proportioning by weight: organophosphoric acid 20g / L, phosphoric acid 50g / L, 1-hydroxyethyl-2-cocoyl imidazoline 0.2g / L, oleoyl diethanolamine 0.2g / L, alkane 0.1g / L of phenol polyoxyethylene ether, 0.05g / L of hydrofluoric acid, 0.2g / L of acetic acid, and the rest is deionized water.

Embodiment 2

[0015] Embodiment 2, comprises according to the proportioning by weight: organophosphoric acid 30g / L, phosphoric acid 60g / L, 1-hydroxyethyl-2-cocoyl imidazoline 0.05g / L, oleoyl diethanolamine 0.2g / L, alkane Base phenol polyoxyethylene ether 0.05g / L, hydrofluoric acid 0.05g / L, acetic acid 0.5g / L, and the rest is deionized water.

Embodiment 3

[0016] Embodiment 3, comprises according to the proportioning of weight: organophosphoric acid 50g / L, phosphoric acid 70g / L, 1-hydroxyethyl-2-cocoyl imidazoline 0.1g / L, oleoyl diethanolamine 0.2g / L, alkane Base phenol polyoxyethylene ether 0.05g / L, hydrofluoric acid 0.1g / L, acetic acid 1g / L, and the rest is deionized water.

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PUM

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Abstract

The invention discloses a copper-based tin-plated high-temperature resisting protective agent. The copper-based tin-plated high temperature protective agent is prepared from the following components in weight ratio: 20 to 100g / L of organic phosphonic acid, 50 to 200g / L of phosphoric acid, 0.01 to 0.2g / L of 1-ethoxyl-2-coco-imidazoline, 0.2 to 0.5g / L of oleyl diethanolamine, 0.05 to 0.1g / L of alkylphenol ethoxylates, 0.05 to 0.2g / L of hydrofluoric acid, 0.2 to 2g / L of acetic acid and the balance of deionized water. The copper-based tin-plated high-temperature resisting protective agent providedby the invention has the advantages of simple preparation, convenience in operation, low cost and capabilities of obviously improving high-temperature antioxidation performance of tin and improving tin solderability.

Description

technical field [0001] The invention relates to the technical field of surface electroplating of metal parts, in particular to a copper-based tin plating high temperature resistant protective agent. Background technique [0002] Electronic components are usually tin-plated on copper substrates. The current tin-plating process for electronic components generally adopts electroplating process. And - wash - tumble dry. During the placement process (SMT) of components, the temperature reaches 245-270°C, and the solder paste and the tin layer on the surface of electronic components are melted, so as to realize the welding between components. However, during the soldering process, there will be abnormalities such as melting tin, discoloration, and poor soldering, which directly affect product reliability. [0003] Therefore, the prior art still needs to be improved and developed. Contents of the invention [0004] The technical problem to be solved by the present invention is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/48C25D3/30
CPCC25D5/48C25D3/30
Inventor 刘德强
Owner SHENZHEN SHENGYUAN SEMICON