Copper-based tin-plated high-temperature resisting protective agent
A technology of high temperature resistance and protective agent, which is applied in the field of high temperature resistant protective agent for copper-based tin plating. It can solve problems that affect product reliability, poor welding, discoloration, etc., and achieve improved tin high temperature oxidation resistance, simple configuration, and convenient operation. Effect
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Embodiment 1
[0014] Embodiment 1, comprises according to the proportioning by weight: organophosphoric acid 20g / L, phosphoric acid 50g / L, 1-hydroxyethyl-2-cocoyl imidazoline 0.2g / L, oleoyl diethanolamine 0.2g / L, alkane 0.1g / L of phenol polyoxyethylene ether, 0.05g / L of hydrofluoric acid, 0.2g / L of acetic acid, and the rest is deionized water.
Embodiment 2
[0015] Embodiment 2, comprises according to the proportioning by weight: organophosphoric acid 30g / L, phosphoric acid 60g / L, 1-hydroxyethyl-2-cocoyl imidazoline 0.05g / L, oleoyl diethanolamine 0.2g / L, alkane Base phenol polyoxyethylene ether 0.05g / L, hydrofluoric acid 0.05g / L, acetic acid 0.5g / L, and the rest is deionized water.
Embodiment 3
[0016] Embodiment 3, comprises according to the proportioning of weight: organophosphoric acid 50g / L, phosphoric acid 70g / L, 1-hydroxyethyl-2-cocoyl imidazoline 0.1g / L, oleoyl diethanolamine 0.2g / L, alkane Base phenol polyoxyethylene ether 0.05g / L, hydrofluoric acid 0.1g / L, acetic acid 1g / L, and the rest is deionized water.
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