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Modified epoxy resin and uses of modified epoxy resin in field of electronics

An epoxy resin and modified technology, applied in modified epoxy resin and in the fields of electronics and electronics, can solve the problems of poor hot crack formability and little research on the influence of Al2O3 filler on the comprehensive performance of epoxy resin. , to achieve the effect of excellent performance

Inactive Publication Date: 2018-07-27
郁海丰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although ceramic packaging materials have the above characteristics, their application is greatly limited due to thermal cracking, brittleness, and poor formability during packaging manufacturing.
[0003] There have been many reports on the performance and application of epoxy resin packaging materials modified with Al2O3 ceramic particles, but there are not many studies on the influence of Al2O3 fillers with different particle sizes and shapes on the comprehensive properties of epoxy resins.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The zinc sulfide modified epoxy resin for electronic packaging is prepared from the following raw materials in parts by weight: 45 parts of epoxy resin, 20 parts of zinc sulfide, 6 parts of graphite oxide, and 25 parts of polyvinyl alcohol.

Embodiment 2

[0016] The zinc sulfide modified epoxy resin for electronic packaging is prepared from the following raw materials in parts by weight: 40 parts of epoxy resin, 15 parts of zinc sulfide, 4 parts of graphite oxide, and 20 parts of polyvinyl alcohol.

Embodiment 3

[0018] The zinc sulfide modified epoxy resin for electronic packaging is prepared from the following raw materials in parts by weight: 50 parts of epoxy resin, 25 parts of zinc sulfide, 8 parts of graphite oxide, and 30 parts of polyvinyl alcohol.

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PUM

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Abstract

The invention discloses a modified epoxy resin and uses of the modified epoxy resin in the field of electronics, wherein the modified epoxy resin is prepared from the following raw materials by weight: 40-50 parts of an epoxy resin, 15-25 parts of zinc sulfide, 4-8 parts of graphite oxide, and 20-30 parts of polyvinyl alcohol. The zinc sulfide modified epoxy resin of the present invention has excellent performance and can be used for preparing electronic packaging materials.

Description

technical field [0001] The invention belongs to the field of electronics, and in particular relates to a modified epoxy resin and its application in the field of electronics. Background technique [0002] Packaging materials for electronic devices are an important part of the information industry. Microelectronics technology requires its packaging materials to have good heat dissipation, low expansion coefficient and good electrical insulation properties. Although the ceramic packaging material has the above-mentioned characteristics, its application is greatly limited due to the phenomenon of thermal cracking, brittleness and poor formability during the packaging process. [0003] There have been many reports on the performance and application of epoxy resin packaging materials modified with Al2O3 ceramic particles, but there are not many studies on the influence of Al2O3 fillers with different particle sizes and shapes on the comprehensive properties of epoxy resins. Acc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L29/04C08K3/30C08K3/04
CPCC08L63/00C08K2003/3036C08L2203/206C08L29/04C08K3/30C08K3/04
Inventor 不公告发明人
Owner 郁海丰