Vacuum absorbing template for semiconductor wafer polishing device and polishing device

Abstract

The invention provides a vacuum absorbing template for a semiconductor wafer polishing device and a polishing device, and belongs to the technical field of wafer polishing. The vacuum absorbing template for the semiconductor wafer polishing device comprises a ceramic disc positioned on a polishing head; a groove is formed in the disc surface of the ceramic disc; a vacuum sucker is positioned in the groove; the peripheral edge of the vacuum sucker downwards extends to form a cap edge structure; and a groove is formed in the inner surface of the vacuum sucker, and is connected with a vacuum generation structure by dint of a vacuum hole penetrating through the ceramic disc for vacuum absorption positioning of wafers. The vacuum absorbing template for the semiconductor wafer polishing device has the following beneficial effects: such process links as wax bonding and wax removal are saved, so that the machining time is shortened, and the pollution is prevented; the cap edge structure achieves an anti-scratch protecting effect on the wafers, so that the vacuum absorbing template is more suitable for polishing of semiconductor wafers with lower hardness and formed by such volatile elements as Si, Ge, GaAs and InP; and the vacuum absorbing template achieves a stable positioning maintenance effect on the wafers, improves the yield and the thickness uniformity, and reduces the productioncost.

Description

technical field [0001] The invention relates to the technical field of wafer polishing, in particular to a vacuum adsorption template and a polishing device for a semiconductor wafer polishing device, especially suitable for VGF crystal growth of semiconductor crystal materials such as indium phosphide and gallium phosphide that need to be synthesized with volatile elements . Background technique [0002] Nowadays, the application range of semiconductor materials is more and more extensive, including computers, electronic devices, optical fiber communications, etc., and semiconductor materials are playing an important role. Such as Si, Ge, III-V compound semiconductor materials and so on. In the technical field of material preparation, single-side polishing of wafers is an important process link. At present, most of the single-side polishing processes use solid wax or liquid wax to stick the wafer to the polishing disc, then perform the polishing process on a single polish...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the technical problems of complicated wafer polishing process, heavy pollution, high cost and time-consuming and labor-consuming, the present invention provides a vacuum adsorption template for a semiconductor wafer polishing device and a device containing the template, which adopts an improved ceramic disc structure, A vacuum suction cup with a visor structure is added between the ceramic plate and the wafer, and the technical scheme of vacuum adsorption and positioning of the wafer is connected to the vacuum generating structure through the through hole, which realizes the firm positioning of the five-sided wrapping of the wafer, and comprehensively protects the upper surface of the wafer and At the same time, it is convenient for rapid polishing processing, which improves the yield and thickness uniformity, avoids pollution, and reduces costs.

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