Electronic product vacuum uniform-heat assembly welding device and welding method thereof

Abstract

The invention provides an electronic product vacuum uniform-heat assembly welding device and a welding method thereof. The welding device comprises a heating base, a conductive pressing strip, a hot pressing module and a resistance adjusting module. The heating base is used for positioning the electronic product to be welded, and is used for heating an electronic product cover plate; the conductive pressing strip is used for pressing the heating base, and is used as an electrode to conduct current on the heating base; the hot pressing module is arranged on the heating base and is used for heating the box body of the electronic product; the pressure adjusting module is arranged on the hot pressing module, and the temperature adjusting module is used for adjusting the temperature of the hotpressing module; and the heating base and the hot pressing module are heated in a vacuum chamber at the same time to realize the uniform-heat assembly welding of the electronic product. Compared withthe prior art, the electronic product vacuum uniform-heat assembly welding device has the advantages that welding and heating are uniform, the welding efficiency is high, the welding quality consistency is good, the welding positioning precision is high, the reliability is good, the operation is simple, the electric heating is pollution-free, and the device is suitable for large-scale production.

Description

technical field [0001] The invention belongs to the technical field of assembly and welding of electronic products, and in particular relates to a vacuum soaking assembly and welding device and welding method for electronic products suitable for the aerospace field. Background technique [0002] In the assembly process of high-performance electronic products, it is generally required to have a high penetration rate between the box body and the cover of the electronic product, and the solder should not be oxidized to achieve better product performance. Generally, it is used in a vacuum environment. Do the welding. When vacuum welding is used, there is no oxygen during the solder and melting process, and the surface wettability of the box body and the cover plate is good, so there will be higher welding quality. At present, there are three methods of vacuum assembly and welding commonly used, namely, vacuum electric heating plate heating, vacuum thermal radiation heating, and...

AI Technical Summary

Problems solved by technology

[0004] 1. The current vacuum electric heating plate heating cannot perform three-dimensional uniform heating, and the heat transfer efficiency is low in a vacuum environment. For example, the patent CN 102522343 A is a micro-device vacuum packaging exhaust device and method. In the welding process of this method, the product and electric heating The contact effect of the heat transfer interface between the plates is poor, and heat can only be transferred from one surface, the heat transfer efficiency is low, and the resistance of the electric heating plate is difficult to adjust

[0005] 2. Although vacuum thermal radiation heating can radiate with multiple heat sources, the thermal radiation efficiency is low, the heating is slow and the temperature is difficult to control, such as the patent CN 102339655 B temperature-controlled inflatable vacuum radiation equipment, the thermal radiation equipment is complicated, and the heating efficiency is low. It is not suitable for large-scale mass production

[0006] 3. Vacuum vapor phase welding is to heat the product after injecting the vapor phase liquid to heat up into gas after vacuuming. Although this method can heat evenly, the vacuum degree will drop after injecting the vapor phase liquid, which will affect the welding quality, and the vapor phase liquid Can not be completely recycled, there is a certain pollution to the environment

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