Heat tube radiator with high heat radiation capacity for IGBT

Abstract

The invention discloses a heat tube radiator with high heat radiation capacity for an IGBT. The heat tube radiator comprises a substrate, more than one main heat tube installed on the substrate and multiple radiating fins positioned at one side of the substrate and arranged along the direction far from the substrate successively at interval, each main heat tube is connected with more than one subheat tube, each sub heat tube penetrates the radiating fins successively, the substrate includes a contact heat conduction plane which makes contact with a heat source, the contact heat conduction plane is provided with installation grooves corresponding to the main heat tube, each main heat tube is installed in the corresponding installation groove, and the main heat tube includes a contact heatconduction surface leveled with the contact heat conduction plane. The heat tube radiator with high heat radiation capacity has the advantages including high structural stability, simple installationand high heat radiation efficiency and capability.

Description

technical field [0001] The invention relates to the technical field of heat dissipation devices, in particular to a high heat dissipation heat pipe radiator for IGBTs. Background technique [0002] IGBT is the core device of energy conversion and transmission, commonly known as the "CPU" of power electronic devices. As a national strategic emerging industry, it is widely used in rail transit, smart grid, aerospace, electric vehicles and new energy equipment. [0003] In recent years, with the high-speed and high-frequency of electronic devices, since the miniaturized components using integrated circuits and large-scale integrated circuits tend to be assembled in high density, the heat generation per unit volume is increasing year by year. The normal operating temperature range of electronic components is generally -5°C~+65°C, beyond this range, the performance of components will drop significantly and cannot work stably, which will affect the reliability of system operation....

AI Technical Summary

Problems solved by technology

Due to the thermal resistance of the substrate itself, and the thermal conductivity of the heat pipe is much greater than that of the substrate, the improvement of the heat conduction efficiency of the heat pipe radiator is limited and the heat dissipation performance is reduced

In addition, in the prior art, the evaporation section of the heat pipe is welded to the groove of the substrate, and the contact thermal resistance is relatively large, which requires high processing technology

As the heating power of IGBT devices increases, it is difficult for existing heat pipe radiators to meet the heat dissipation requirements. Usually, the size of the radiator has to be increased to barely apply, which increases the manufacturing cost.

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