Packaging module for LED chips and preparation method of packaging module
A technology of LED chips and packaging modules, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems that the light output of the chip cannot be coupled, the coupling area of the optical system is wasted, and the light-emitting area of the LED chip is wasted, so as to solve the problem of optical coupling efficiency, Easy to realize and improve the effect of light extraction efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0049] A method for preparing a four-in-one LED chip packaging module, the specific implementation steps are as follows:
[0050] 1. Prepare four LED chips, and the light-emitting surfaces of the four LED chips are all 1 / 4 circular sectors;
[0051]2. Bond the four LED chips on the substrate through the solid layer, so that the four LED chips are fixedly connected to the substrate;
[0052] 3. Realize the fixed connection between the electrodes of the four LED chips and the circuit of the substrate through the leads;
[0053] 4. Coating the mixture layer on the upper surface of the LED chip, heating to cure the mixture layer; combining the LED chip and the mixture layer to realize a white light source;
[0054] 5. Install an optical lens once, and seal the four LED chips, solid crystal layer, and leads on the substrate to realize the protection of the LED chips.
Embodiment 1
[0056] Such as Figure 5-7 As shown, a package module of a four-in-one LED chip includes a first LED chip 31, a second LED chip 32, a third LED chip 33, a fourth LED chip 34, a ceramic substrate 35, a silver glue layer 36, a gold Line 37, a mixture layer 38 made of fluorescent powder and silica gel and a flat glass cover plate 39, the light-emitting surfaces of the first LED chip 31, the second LED chip 32, the third LED chip 33, and the fourth LED chip 34 are all 1 / 4 Round fan shape, the first LED chip 31, the second LED chip 32, the third LED chip 33, and the fourth LED chip 34 are all bonded on the ceramic substrate 35 through the silver glue layer 36, and the two ends of the gold wire 37 are connected to the first LED chip respectively. The electrodes of the chip 31, the second LED chip 32, the third LED chip 33, and the fourth LED chip 34 are fixedly connected to the circuit on the ceramic substrate 35, and the fourth LED chip 34 is coated with a mixture layer composed of...
Embodiment 2
[0066] A four-in-one LED packaging module, such as Figure 10-12 As shown, it includes a first LED chip 501, a second LED chip 502, a third LED chip 503, a fourth LED chip 504, a copper substrate 505, a gold-tin solder layer 506, a gold wire 507, and a ball cap lens 508. The light-emitting surfaces of the 1st LED chip 501, the 2nd LED chip 502, the 3rd LED chip 503, and the 4th LED chip 504 are all 1 / 4 circular sectors, and the upper surface of the 1st LED chip 501 is coated with fluorescent powder and silica gel. The first mixture layer 511 is composed of a second mixture layer 512 made of phosphor powder and silica gel coated on the upper surface of the second LED chip 502, and coated with phosphor powder and silica gel on the upper surface of the third LED chip 503. The third mixture layer 513 is formed, and the fourth mixture layer 514 made of fluorescent powder and silica gel is coated on the upper surface of the fourth LED chip 504. The first LED chip 501, the second LED...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More