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Preparation method for Sn based composite solder sheets

A composite welding and sheet technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of poor high-temperature service performance, low joint strength, low efficiency, etc., to ensure fluidity, improve Effects of strength and high temperature stability

Inactive Publication Date: 2018-08-28
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to propose a preparation method of a Sn-based composite solder sheet in view of the above-mentioned prior art. The process is simple, and it can solve the problems of low efficiency in the brazing process, low joint strength, and poor high-temperature service performance.

Method used

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  • Preparation method for Sn based composite solder sheets
  • Preparation method for Sn based composite solder sheets

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The metal foam matrix selected in this embodiment is copper foam and nickel foam with a porosity of 98%, and the solder is pure Sn. The specific operation steps are as follows:

[0027] After the copper foam and nickel foam with a size of 10mm×10mmx0.5mm are degreased and decontaminated, they are cleaned with ultrasonic cleaning and deionized water for 5 minutes each; the treated foamed copper is immersed in molten pure tin, and the temperature of the molten tin is 260°C for 10s, the copper foam reinforced tin-based composite solder sheet was obtained; similarly, the surface-treated foamed nickel metal was immersed in molten tin, the temperature of the molten tin was 260°C, and the time of immersion in the molten tin was 15s. Nickel Foam Reinforced Tin-Based Composite Solder Sheet. Select 3 pieces of Sn-based solder sheets reinforced with copper foam and 2 pieces of Sn-based composite solder sheets reinforced with nickel foam with a relatively uniform surface, stack the...

Embodiment 2

[0030] The metal foam matrix selected in this embodiment is copper foam and nickel foam with a porosity of 60%, and the solder is pure Sn. The specific operation steps are as follows:

[0031] After the copper foam and nickel foam with a size of 10mm×10mmx0.5mm are degreased and decontaminated, they are cleaned with ultrasonic cleaning and deionized water for 5 minutes each; the treated foamed copper is immersed in molten pure tin, and the temperature of the molten tin is 260°C for 10s, the copper foam reinforced tin-based composite solder sheet was obtained; similarly, the surface-treated foamed nickel metal was immersed in molten tin, the temperature of the molten tin was 260°C, and the time of immersion in the molten tin was 15s. Nickel Foam Reinforced Tin-Based Composite Solder Sheet. Select 3 pieces of Sn-based solder sheets reinforced with copper foam and 2 pieces of Sn-based composite solder sheets reinforced with nickel foam with a relatively uniform surface, stack the...

Embodiment 3

[0034] The metal foam matrix selected in this embodiment is copper foam and nickel foam with a porosity of 98%, and the solder is a Sn-Ag alloy. The specific operation steps are as follows:

[0035] After the copper foam and nickel foam with a size of 10mm×10mmx0.5mm are degreased and decontaminated, they are cleaned with ultrasonic cleaning and deionized water for 5 minutes each; the treated foamed copper is immersed in molten pure tin, and the temperature of the molten tin is 260°C for 10s, the copper foam reinforced tin-based composite solder sheet was obtained; similarly, the surface-treated foamed nickel metal was immersed in molten tin, the temperature of the molten tin was 260°C, and the time of immersion in the molten tin was 15s. Nickel Foam Reinforced Tin-Based Composite Solder Sheet. Select 3 pieces of Sn-based solder sheets reinforced with copper foam and 2 pieces of Sn-based composite solder sheets reinforced with nickel foam with a relatively uniform surface, sta...

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Abstract

The invention relates to the technical field of welding, in particular to a preparation method for Sn based composite solder sheets. The preparation method comprises the following steps that S1, trepanned foam metal is subject to surface treatment; S2, filling of molten Sn based solder is carried out, specially, an infiltration manner is adopted for filling the foam metal with the molten Sn basedsolder, then foam metal sheets obtained after surface treatment are immersed into the molten Sn based solder, and the foam metal sheets are taken out after holes are filled with the solder; and S3, alternative stacking hot pressing treatment is carried out, specially, the foam metal sheets filled with the Sn based composite solder are alternatively stacked together, the stacked sheets are subjectto repeated hot pressing treatment, and finally the Sn based composite solder sheets are obtained. The preparation method has the beneficial effects that liquidity of the Sn based solder during brazing is guaranteed; the stacking layer number of foam Cu and foam Ni is changed, and the proportion of Cu to Ni in the composite solder sheets can be effectively controlled; and the strength and the hightemperature stability of a soldered joint are effectively improved.

Description

technical field [0001] The invention relates to the field of soldering technology, in particular to a method for preparing a Sn-based composite solder sheet. Background technique [0002] With the development of electronic packaging technology, people have higher and higher requirements for the performance of small size, high power and high frequency power devices. As an important part of interconnect materials, solder has a direct impact on the performance of interconnect joints. Therefore, improving the strength and high temperature performance of solder has gradually become an important direction for improving the quality of electronic device products. [0003] The low-melting-point composite solder sheet reinforced by metal foam has the advantages of high strength and good soldering performance, and has broad application prospects in the field of electronic packaging. For example, the patent (ZL201710149734X) discloses a method for preparing a foamed metal composite sol...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 肖勇朱陈中宋志鹏牛万里肖珏何煌
Owner WUHAN UNIV OF TECH
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