Method for fabricating photovoltaic module

Abstract

The application discloses a method for fabricating a photovoltaic module, comprising the following steps of: engraving a cast silicon block to obtain a first type silicon block having a square cross section; continuously dividing the first type silicon block in a direction perpendicular to the square cross section to obtain a second type silicon block having a rectangular cross section; cutting the second type silicon block wire into silicon wafers in a direction parallel to the rectangular cross section; fabricating the silicon wafers into battery sheets; and connecting the battery sheets inseries to form the photovoltaic module. The method for fabricating a photovoltaic module above is capable of passivating the cutting surface, thereby improving the efficiency of the battery sheets andenhancing the bending strength of the battery sheets to better avoid damages.

Description

Technical field [0001] The invention belongs to the technical field of photovoltaic equipment manufacturing, and particularly relates to a manufacturing method of photovoltaic components. Background technique [0002] With the development of the photovoltaic industry, various new technologies have been applied to modules to increase the output power of the modules. Especially after the photovoltaic leader plan was proposed, the demand for high-power modules has greatly increased. For photovoltaic modules, the power is The higher the value, the lower the production cost, the lower the cost of component transportation, and the lower the cost of land, support, and maintenance at the power station. Therefore, high-power components are an important measure for energy saving and cost reduction. [0003] In order to increase the power of the modules, new high-efficiency modules such as half-cut modules and laminated modules have been developed. In the production process of the existing ha...

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Problems solved by technology

[0003] In order to improve the module power, new high-efficiency modules such as half-cut modules and laminated modules have been developed. In the production process of the existing half-cut modules and laminated modules, the cell technology is firstly produced, and then the cells are cut from The middle line is cut in half or cut into small pieces from the cutting line, and then connected directly in parallel first and then in series, which will result in the cut surface of the passivated and screen-printed cells being exposed without coating and without passivation. As a result, the suspended single bond on the cut surface will form a recombination center, the electron-hole pair will recombine seriously, and the life of the carrier will be short, which will reduce the efficiency of the cut cell, and the bending strength of the small piece after the cut surface will decrease, which is prone to damage

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