Special conductive adhesive for bonding of carbon contact strips used for pantographs of high-speed railways
A technology for pantograph carbon slides and adhesives, which is applied in the direction of conductive adhesives, non-polymer adhesive additives, adhesives, etc., and can solve problems such as low bonding strength at high temperature, difficulty in stabilizing products, and poor formulation stability, etc. problems, to achieve the effect of stable high and low temperature performance, wide range of curing time and ratio, and superior durability
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Embodiment 1
[0015] The invention provides a special conductive adhesive for high-speed rail pantograph carbon slide plate bonding, including A material and B material, and the A material includes amino epoxy resin, phenolic epoxy resin, liquid carboxylated nitrile rubber, silicon Micropowder and silver-plated copper powder on the surface, the B material includes ethyl imidazole and fumed silica, wherein the mass ratio of each component: in A material, amino epoxy resin accounts for 30%, and novolac epoxy resin accounts for 50%. %, liquid carboxylated nitrile rubber accounts for 5%, silicon micropowder and silver-plated copper powder account for 15%; in material B, ethylimidazole accounts for 89%, and fumed silica accounts for 11%.
[0016] The mass ratio of the A material to the B material is 10:1.3.
[0017] The amino epoxy resin model is set to amino epoxy resin AG-80, the novolac epoxy resin model is set to novolac epoxy resin F-51, and the ethyl imidazole model is set to 2-methyl-4 et...
Embodiment 2
[0024] The invention provides a special conductive adhesive for high-speed rail pantograph carbon slide plate bonding, including A material and B material, and the A material includes amino epoxy resin, phenolic epoxy resin, liquid carboxylated nitrile rubber, silicon Micropowder and silver-plated copper powder on the surface, the B material includes ethyl imidazole and fumed silica, wherein the mass ratio of each component: in A material, amino epoxy resin accounts for 55%, and novolac epoxy resin accounts for 25%. %, liquid carboxylated nitrile rubber accounts for 5%, silicon micropowder and silver-plated copper powder account for 15%; in material B, ethylimidazole accounts for 96%, and fumed silica accounts for 4%.
[0025] The mass ratio of the A material to the B material is 10:4.5.
[0026] The amino epoxy resin model is set to amino epoxy resin AG-80, the novolac epoxy resin model is set to novolac epoxy resin F-51, and the ethyl imidazole model is set to 2-methyl-4 eth...
Embodiment 3
[0033] The invention provides a special conductive adhesive for high-speed rail pantograph carbon slide plate bonding, including A material and B material, and the A material includes amino epoxy resin, phenolic epoxy resin, liquid carboxylated nitrile rubber, silicon Micropowder and silver-plated copper powder on the surface, the B material includes ethyl imidazole and fumed silica, wherein the mass ratio of each component: in A material, amino epoxy resin accounts for 24%, and novolac epoxy resin accounts for 43%. %, liquid carboxylated nitrile rubber accounts for 6%, silicon micropowder and silver-plated copper powder account for 27%; in material B, ethylimidazole accounts for 93%, and fumed silica accounts for 7%.
[0034] The mass ratio of the A material to the B material is 10:2.9.
[0035] The amino epoxy resin model is set to amino epoxy resin AG-80, the novolac epoxy resin model is set to novolac epoxy resin F-51, and the ethyl imidazole model is set to 2-methyl-4 eth...
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Abstract
Description
Claims
Application Information
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