Self-adaptive regulating heat dissipation device capable of intelligently responding to hot spots of chip

Abstract

The invention discloses a self-adaptive regulating heat dissipation device capable of intelligently responding to hot spots of chip, comprising a heat dissipation device base plate and an upper coverplate, wherein a through hole is etched in the center position of the upper cover plate, a center fluid inlet corresponding to the through hole and having radius the same as that of the through hole is etched in the heat dissipation device base plate, a plurality of fractal micro-channels communicated with the center fluid inlet are further etched in the heat dissipation device base plate, a horizontal H-shaped thermal shrinkage type thermo-sensitive type hydrogel is embedded to each fractal micro-channel and in the side wall of each of two branch runners, pits are respectively formed in the other side walls of the two branch runners, and the pits and the hydrogel are arranged in a staggered way in the branch runner. The device is strong in heat exchange capacity, and small in flowing pressure drop. The hydrogel can intelligently respond to local hot spots of the chip and generate volume change in a certain temperature condition, so as to perform self-adaptive flow regulation and flowre-distribution on heat dissipation fluid in the fractal micro-channels, rapidly take away heat of local hot spots of the chip, and maintain the uniformity of the surface temperature of the chip.

Description

technical field [0001] The invention relates to a chip heat dissipation device, in particular to an adaptive control heat dissipation device that intelligently responds to chip hot spots. Background technique [0002] In recent years, with the development of microelectronics technology, especially military electronics and microwave devices, high-power electronic chips are developing rapidly in the direction of miniaturization and multi-integration. From an integration perspective, Moore's Law states that the number of semiconductor devices within an IC device will double every 18 months. According to the statistics and forecast report of ITRS in 2014, on the basis of maintaining the same chip size, the number of integrated semiconductors per unit area gradually increases with each year, and the chip feature size is decreasing year by year, resulting in the power per unit volume of electronic components The density is getting higher and higher, and the heat flux density of t...

AI Technical Summary

Problems solved by technology

Due to the fixed structure, this cooling technology can only mechanically cool the hot spots in the fixed area, and the cooling effect on the uncontrollable hot spots of the chip is poor

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