Thermosetting resin composition for sealing, and sheet for sealing
A resin composition and thermosetting technology, applied in the fields of electric solid device, climate sustainability, semiconductor/solid device manufacturing, etc., can solve the problems of increasing resistance, brightness reduction, peeling, etc., and achieve the effect of prolonging the life of components and inhibiting deterioration.
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[0136] Example
[0137] Hereinafter, the present invention will be specifically explained through examples, but the present invention is not limited by these examples. In addition, in the following description, unless otherwise specified, "%" and "parts" other than the reaction rate and thermal weight loss rate of the cured product indicate "mass %" and "mass parts", respectively. As for the hydrotalcite, all commercially available hydrotalcites whose saturated water absorption rate, thermal weight loss rate, and X-ray diffraction peak were measured were used.
[0138]
[0139] The following steps were used to synthesize N-acetylglycine tetrabutylphosphonium salt as an ionic liquid curing agent. To 20.0 g of a 41.4% tetrabutylphosphonium hydroxide aqueous solution (manufactured by Beixing Chemical Industry Co., Ltd.) at 0°C, 3.54 g of N-acetylglycine (manufactured by Tokyo Chemical Industry Co., Ltd.) was added, and the mixture was stirred for 10 minutes . Using an evaporator, t...
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[0143]
[0144] Instead of hydrotalcite A (22 parts), hydrotalcite B (BET specific surface area 15m 2 / g, 15 parts), except that it was the same as Example 1, the thermosetting resin composition varnish was produced, and the sheet for sealing was obtained.
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[0145]
[0146] Instead of hydrotalcite A (22 parts), hydrotalcite A (14 parts) and hydrotalcite C (BET specific surface area 146m 2 / g, 5 parts) of mixed hydrotalcite (BET specific surface area 48m 2 / g), except that it was the same as in Example 1 to produce a thermosetting resin composition varnish to obtain a sealing sheet.
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