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Thermosetting resin composition for sealing, and sheet for sealing

A resin composition and thermosetting technology, applied in the fields of electric solid device, climate sustainability, semiconductor/solid device manufacturing, etc., can solve the problems of increasing resistance, brightness reduction, peeling, etc., and achieve the effect of prolonging the life of components and inhibiting deterioration.

Active Publication Date: 2018-09-04
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that the resistance of the organic EL element to moisture is very weak, and the light-emitting material (light-emitting layer) is deteriorated due to water, and the luminance is lowered, or it no longer emits light, or the interface between the electrode and the light-emitting layer is Delamination occurs under the influence of moisture, or metal oxidation increases resistance

Method used

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  • Thermosetting resin composition for sealing, and sheet for sealing
  • Thermosetting resin composition for sealing, and sheet for sealing

Examples

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Embodiment

[0137] Hereafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples. In the following description, unless otherwise specified, "%" and "part" other than the reaction rate and thermal weight loss rate of the cured product represent "mass%" and "mass part", respectively. As the hydrotalcites, all commercially available hydrotalcites whose saturated water absorption rate, thermal weight loss rate, and X-ray diffraction peak were measured were used.

[0138]

[0139] The following steps were used to synthesize N-acetylglycine tetrabutylphosphonium salt as an ionic liquid curing agent. To 20.0 g of a 41.4% tetrabutylphosphonium hydroxide aqueous solution (manufactured by Hokko Chemical Industry Co., Ltd.), 3.54 g of N-acetylglycine (manufactured by Tokyo Chemical Industry Co., Ltd.) was added at 0° C., and stirred for 10 minutes . Using an evaporator, the reaction solution was concentrated at 60 to 80° C. for 2 hours at ...

Embodiment 2

[0144] Instead of hydrotalcite A (22 parts), hydrotalcite B (BET specific surface area 15m 2 / g, 15 parts), except that, it was carried out similarly to Example 1, the thermosetting resin composition varnish was manufactured, and the sheet|seat for sealing was obtained.

Embodiment 3

[0146] Instead of hydrotalcite A (22 parts), hydrotalcite A (14 parts) and hydrotalcite C (BET specific surface area 146m 2 / g, 5 parts) mixed hydrotalcite (BET specific surface area 48m 2 / g) except that, it carried out similarly to Example 1, the thermosetting resin composition varnish was manufactured, and the sheet|seat for sealing was obtained.

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Abstract

The present invention provides a thermosetting resin composition for sealing, which contains (A) a thermosetting resin, (B) a curing agent and (C) semi-calcined hydrotalcite as an inorganic filler, wherein when the thermogravimetric loss rate prior to moisture absorption, as measured by thermogravimetric analysis, at 280 DEG C of a cured product of the thermosetting resin composition is denoted byX1 (%), the thermogravimetric loss rate prior to moisture absorption of the cured product at 380 DEG C is denoted by Y1 (%), the thermogravimetric loss rate following moisture absorption, as measuredby thermogravimetric analysis, at 280 DEG C of the cured product of the thermosetting resin composition is denoted by X2 (%) and the thermogravimetric loss rate following moisture absorption of the cured product at 380oC is denoted by Y2 (%), the relationships 2% <= X2-X1 and Y2-Y1 <= 10% are satisfied and the overall content of inorganic filler, including semi-calcined hydrotalcite, is 20-60 mass% relative to the overall quantity of non-volatile components in the thermosetting resin composition.

Description

technical field [0001] The present invention relates to a thermosetting resin composition for sealing and a sheet for sealing, and particularly relates to a thermosetting resin suitable for sealing light-emitting elements such as organic EL (Electroluminescence) elements, and photoelectric conversion elements such as light-receiving elements such as solar cells. Composition and sheet for sealing. Background technique [0002] An organic EL element is a light-emitting element using an organic substance as a light-emitting material, and has attracted attention in recent years because it can obtain high-intensity light emission at a low voltage. However, there is a problem that the resistance of the organic EL element to moisture is very weak, and the light-emitting material (light-emitting layer) is deteriorated due to water, and the luminance is lowered, or it no longer emits light, or the interface between the electrode and the light-emitting layer is Peeling occurs under t...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/00C08K3/26C08K3/34C08L101/00H01L51/50H05B33/04H01L31/048
CPCC08K3/00C08K3/26C08K3/34C08L63/00C08L101/00H01L31/048H05B33/04Y02E10/50Y02P70/50H10K50/841
Inventor 久保有希
Owner AJINOMOTO CO INC
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