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Production of a multi-chip component

A technology of multi-chip components and chips, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as difficulty in chip installation

Inactive Publication Date: 2018-09-04
OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The large undercut of the mounting pad that can be provided for this purpose makes chip mounting more difficult

Method used

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  • Production of a multi-chip component
  • Production of a multi-chip component
  • Production of a multi-chip component

Examples

Experimental program
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Embodiment Construction

[0066] A possible configuration of the method for producing a surface-mountable multi-chip component realized in the form of a QFN package (Quad Flat No Leads) is described with reference to the following schematic diagram. In the method, processes known from semiconductor technology and electronic component manufacturing can be performed and conventional materials in these fields can be used, so they will only be discussed in part. In the same manner, further processes may be performed in addition to those shown and described, and components may be manufactured with component parts and structures other than those shown and described. Furthermore, it should be pointed out that the drawings are schematic in nature and not true to scale. In this sense, component parts and structures shown in the drawings may be illustrated in exaggerated size or reduced in size to provide better understanding.

[0067] The method is used to manufacture multiple multi-chip modules with the same ...

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Abstract

The invention relates to a method for producing a surface-mountable multi-chip component (101; 102; 103; 104; 105). The method comprises the step of providing a chip assembly. The chip assembly has anexposed metallic conductive structure (110) on a rear side, several semiconductor chips (150) and a housing material (160). The method also consists of a step of forming a solder stop layer (170) onthe rear side of the provided chip assembly. Said solder stop layer (170) separates connection areas (121) of the conductor structure (110). The invention also relates to a surface-mountable multi-chip-component (101; 102; 103; 104; 105).

Description

technical field [0001] The invention relates to a method for producing a surface-mountable multi-chip module. The invention also relates to a surface-mountable multi-chip module. [0002] This patent application claims priority from German patent application 10 2016 101 526.1, the disclosure content of which is hereby incorporated by reference. Background technique [0003] Electronic components may be realized in the form of multi-chip components comprising a plurality of semiconductor chips, such as eg optoelectronic components for generating optical radiation. The component may be a QFN component (QuadFlat No Leads) suitable for surface mounting by soldering. In the case of such a design, the assembly may comprise a conductor structure comprising a plurality of conductor parts, on which the semiconductor chip and the housing material are arranged. On the rear side, the conductor structure may comprise solderable connection pads (pads). [0004] The conductor structure...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/00H01L33/44H01L33/48H01L33/62H01L33/50H01L33/52
CPCH01L25/0753H01L2224/48465H01L2933/0033H01L2933/0066H01L2924/00014H01L33/0095H01L2224/45099H01L24/97H01L23/49582H01L23/495H01L23/3107H01L33/62H01L33/52H01L21/565H01L21/4821H01L21/56H01L21/4846H01L21/4871H01L24/48H01L33/486H01L2224/484H01L2933/005
Inventor M.齐齐尔施珀格T.格布尔S.艾歇尔
Owner OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG