High heat dissipation coating for outer shell of electronic device

An electronic device, high heat dissipation technology, applied in the direction of coating, etc., can solve the problems of high cost and the heat dissipation performance of heat dissipation coating can not be significantly improved, and achieve high economic value, excellent heat conduction and heat dissipation performance, and reduce the use cost.
CN108504152AInactive Publication Date: 2018-09-07合肥仁德电子科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
合肥仁德电子科技有限公司
Publication Date
2018-09-07
Estimated Expiration
Not applicable · inactive patent
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Abstract

The invention relates to the technical field of coating, and in particular, relates to a high heat dissipation coating for an outer shell of an electronic device. The heat dissipation coating containsthe following components: silver-plated glass micro-beads, spinel, a graphite powder, nano carbon tubes, epoxy resin, methyl methacrylate, glycerol, and a stabilizer. The silver-plated glass microspheres are prepared by spheroidizing, coarsening, sensitizing, copper plating and replacement silver plating of a sodium calcium silicate micro-powder. The waste glass is selected from sodium calcium silicate glass; spinel is selected from one of aluminum spinel, zinc spinel, manganese spinel and chrome spinel; the stabilizer is industrial gelatin; the base material selected in the heat dissipationcoating has excellent thermal conductivity, the heat dissipation performance of the coating can be significantly improved, and the use cost of precious metals in the coating can be reduced.
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Description

technical field

[0001] The invention relates to the technical field of coatings, in particular to a high heat dissipation coating for electronic equipment shells. Background technique

[0002] During the use of electronic products, a large amount of heat will be generated. If the heat cannot be dissipated quickly, it will cause local overheating of the equipment, reduce the working performance of electronic products, and seriously affect the service life of electronic products. In order to improve the performance of the product, most electronic products will consider heat dissipation at the beginning of design. At present, the main heat dissipation methods used include air cooling and liquid cooling. These two technical means need to occupy a large space and are generally used for large Inside the equipment, and for some small components and equipment casings, the usual heat dissipation means are to install metal heat dissipation fins or apply heat dissipation paint. [000...

Claims

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