OLED display panel and packaging method thereof

Abstract

The present invention provides an OLED display panel and a packaging method thereof. The method includes the following steps that: an OLED display panel to be packaged is provided, an OLED light emitting device layer is prepared at the display area of the OLED display panel, and an organic peeling layer is prepared at the preset position of the non-display area of the OLED display panel, whereinthe preset position of the non-display area surrounds the display area; a packaging process is performed on the OLED display panel, and inorganic film layers and organic film layers are sequentially and alternately stacked on the OLED display panel, wherein the inorganic film layers cover the display area and the non-display area, and the organic film layers cover the display area; and peeling operation is performed on the organic peeling layer, so that the organic peeling layer and corresponding portions of the inorganic film layers which cover the organic peeling layer are peeled off together, and therefore, a thin film packaging layer wrapping the OLED light-emitting device layer can be formed.

Description

technical field [0001] The invention relates to the technical field of display manufacturing, in particular to an OLED display panel and a packaging method thereof. Background technique [0002] Due to its low power consumption and bendability, flexible OLED displays are very suitable for use in wearable display devices, and are currently a hot area for the development of the display industry. As for the thin-film packaging design of flexible OLED display panels, organic / inorganic film layer overlapping structures are generally used to achieve the purpose of blocking water, oxygen and particles, and stress relief. [0003] At present, the manufacturing process of inorganic film layers in thin film packaging is generally through plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD), atomic layer deposition (Atomic layer deposition, ALD) or pulsed laser deposition (Pulsed Laser Deposition, PLD) And other process methods are deposited, an...

AI Technical Summary

Problems solved by technology

During the PECVD process, if the surface of the mask is contaminated with dirt or foreign matter is not cleaned in time, arcing (arcing) is prone to occur under the action of positive and negative electric fields, resulting in damage to the mask; at the same time, the surface of the mask will also be damaged due to plasma erosion. Replacement on time, high maintenance cost

For ALD, PLD and other processes, since there is no self-cleaning function, the surface of the mask will gradually accumulate the deposited film layer with the use time, the cleaning of the mask is more difficult, and the overall cost is higher

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