Chip pin welding defect detection system and method based on thermal imaging detection
A welding defect and detection system technology, applied in material defect testing, electrical components, electrical components, etc., can solve the problems of long manufacturing cycle, unusable molds, limited needle beds, etc., achieve high speed, improve fast imaging and automatic separation The effect of high ability and detection accuracy
Inactive Publication Date: 2018-09-21
FUQING BRANCH OF FUJIAN NORMAL UNIV
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Problems solved by technology
However, due to the shortening of the chip product development cycle, the variety of chip products, the miniaturization and the improvement of assembly density, it is necessary to specially design test points and test molds, the manufacturing cycle is long, the price is expensive, and the original mold cannot be used after the circuit is changed. application of bed of needle detection
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[0033] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.
[0034] Such as figure 1 As shown, the present invention provides a chip pin welding defect detection system based on thermal imaging detection, and the system includes: a thermal imager 3, a chip under test 4 and a processing module 15, and the thermal imager 3 is used for Detecting the temperature difference between the solder joints of the...
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The invention relates to the field of welding detection and discloses a chip pin welding defect detection system and method based on thermal imaging detection. The system comprises a thermal imager, atested chip and a processing module; the thermal imager is used for detecting the temperature difference between a pin welding point of the tested chip and a background and recording the temperaturefield distribution of the surface of the welding spot, so that an infrared thermal image video of the pin welding point of the tested chip is obtained; the processing module is used for processing aninfrared thermal image video to obtain a welding defect result of a pin of the tested chip. The system has the advantages that the detection precision is high, the speed is high, and a large-scale area can be detected at a time; an object to be detected is not damaged; defects of the welding point can be quantitatively detected through eddy current heating in the object to be detected.
Description
technical field [0001] The invention relates to the field of welding detection, in particular to a thermal imaging detection-based detection system and method for chip lead welding defects. Background technique [0002] With the development trend of integrated circuits towards densification, microchips are widely used in printed circuit board assembly. Therefore, the soldering quality between the chip and the printed circuit board is very important. Welding, bridging, less tin, and more tin are common soldering defects. Manual visual inspection and automatic optical inspection are the main inspection methods at present. In actual production, due to the miniaturization of chips, manual visual inspection has low efficiency and insufficient accuracy, and it is difficult to meet the actual high-speed production needs. At present, the actual detection of solder joint defects in the actual production of enterprises mainly relies on automatic optical inspection, but in the automa...
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Login to View More IPC IPC(8): G01N25/72H05K13/08
CPCG01N25/72H05K13/08
Inventor 徐鲁雄张宏吴瑞坤
Owner FUQING BRANCH OF FUJIAN NORMAL UNIV