Heater component reliability test device for microwave vacuum electronic device

Abstract

The invention provides a heater component reliability test device for a microwave vacuum electronic device. The heater component reliability test device for the microwave vacuum electronic device comprises a pipe shell, an electrode flange assembly, an exhaust flange assembly, sealing rings and a connecting piece, wherein the pipe shell has a tubular structure; the electrode flange assembly is arranged at one end of the pipe shell and comprises an upper flange and M electrodes, and the M is greater than or equal to 2; the exhaust flange assembly is arranged at the other end of the pipe shell and comprises a lower flange and an exhaust interface; the sealing rings are arranged between the upper flange and the pipe shell and between the lower flange and the pipe shell respectively; the connecting piece is arranged between the electrode and a detected heater assembly and is used for conducting electricity and supporting and fixing the detected heater assembly. A plurality of the test devices, a valve and an externally connected vacuum pump unit jointly form a heater component reliability test system which is used for detecting an excellent-performance heater component for the microwave vacuum electronic device, so that the problem that heater disconnection caused by the factors such as heater shortcircuit, or heater defect and infirm heater welding point is liable to occur in theuse process of the heater assembly for the microwave vacuum electronic device is relieved.

Description

technical field [0001] The disclosure belongs to the technical field of microwave vacuum electronic devices, and in particular relates to a thermal subassembly reliability testing device for microwave vacuum electronic devices, which is used for reliability testing of thermal subassembly of microwave vacuum electronic devices. Background technique [0002] Microwave vacuum electronic devices are widely used in radar, satellite communications, electron accelerators, global positioning, controllable thermonuclear fusion, and high-power microwave weapons in the future military frontier. Their unique functions and superior performance, especially in high-power and In the case of high frequency band, it cannot be replaced by other devices. After decades of development, although the theory of conventional microwave vacuum electronic devices and related technologies has been basically mature, modern high-tech microwave devices continue to put forward new development requirements fo...

AI Technical Summary

Problems solved by technology

However, during the use of this sintered thermal sub-assembly, it is often found that the thermal sub-circuit is broken due to factors such as short circuit of the thermal sub-unit, defects of the thermal sub-assembly, and weak welding points of the thermal sub-assembly.

Therefore, it is necessary to check the reliability of the thermal sub-assembly so as to avoid the problem of thermal break and short circuit caused by factors such as thermal sub-defects discovered during the use of microwave devices, thermal sub-welding joints are not firm, etc.

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