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Processing method

A processing method and a technology of processed objects, which are applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of rising manufacturing costs and generation of debris

Pending Publication Date: 2018-10-09
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, when the film is removed with a laser beam, there is a problem of generation of debris, and there is also a problem of high manufacturing cost because it is usually processed by an expensive laser processing device
[0005] Therefore, when processing a plate-shaped workpiece on which a film is formed, there is a problem that the workpiece can be processed without clogging the cutting tool and without using a laser processing device.

Method used

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Embodiment approach 1

[0024] Below, implement the processing method of the present invention by figure 1 Each step of the processing method for producing a chip having the device D from the workpiece W shown will be described.

[0025] (1-1) Groove forming process using a cutting device

[0026] First, implement the groove forming step from figure 1 Grooves are formed on the front surface W1a of the workpiece W shown along lines S to be divided. In this groove forming step, for example, using figure 2 The cutting device 1 shown is used for groove formation.

[0027] When forming grooves, such as figure 2 As shown, the workpiece W is in the following state: a dicing tape T1 having a diameter larger than the workpiece W is attached to the back surface W2b of the workpiece W, and the outer peripheral portion of the adhesive surface of the dicing tape T1 is attached to the ring frame. on F1. And the workpiece W in the state where the front surface W1a is exposed upward is supported by the ring ...

Embodiment approach 2

[0081] Below, implement the processing method of the present invention by figure 1 Each step of the processing method for producing a chip having the device D from the workpiece W shown will be described. In Embodiment 2 of the processing method of the present invention, as in Embodiment 1 of the processing method of the present invention, first, (1-1) a groove forming step using a cutting device or (1-2) a step of forming a groove using a plasma etching device is performed. Any step in the groove forming step such as image 3 As shown, grooves M1 whose depth does not reach the film W2 are formed on the workpiece W along all the planned dividing lines S.

[0082] (2) Hold step

[0083] After performing either of (1-1) the groove forming step using the cutting device 1 or (1-2) the groove forming step using the plasma etching device 9, as Figure 5 As shown in , stick the protective tape T3 on the front W1a of the workpiece W, and place the figure 2 Scribe Tape T1 as shown o...

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Abstract

Provided is a processing method, when a plate-shaped workpiece to be formed is divided, the workpiece can be processed without causing the clogging of a cutting tool and without using a laser processing apparatus. The processing method has the steps of: a groove forming step: a groove (M1) is formed from a front surface (W1a) of the workpiece (W) along a dividing line (S); a holding step: after performing the groove forming step, the front side of the workpiece is held to expose the film (W2) on the back surface (W2b) side of the workpiece; a high-pressure water jetting step: after the holdingstep is performed, high-pressure water is sprayed on the back side of the workpiece and the film is divided along the groove so that at least a part of the groove penetrates on the back side; a solidcarbon dioxide particle spraying step: the solid carbon dioxide particles (P1) are sprayed on the back side of the workpiece to which the high-pressure water has been sprayed, so that the film corresponding to the groove is removed.

Description

technical field [0001] The present invention relates to a processing method, which is a processing method of a workpiece in which a plurality of dividing lines are set and a film is formed on the back surface of a plate-like object. Background technique [0002] When a plate-shaped object having a metal film, a resin film, etc., especially a ductile film, is cut with a cutting tool, the cutting tool is clogged by the film. Therefore, a method of removing the above-mentioned film with a laser beam before cutting is proposed (for example, refer to Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2016-42526 [0004] However, when the film is removed with a laser beam, there is a problem of chipping, and since processing is usually performed with an expensive laser processing device, there is also a problem of increased manufacturing cost. [0005] Thus, when processing a plate-shaped workpiece on which a film is formed, there is a problem that the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78
CPCH01L21/78H01L21/76H01L21/3065
Inventor 田渕智隆
Owner DISCO CORP
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