Substrate structure of millimeter wave frequency band microstrip line circuit and implementation method thereof

Abstract

The invention discloses a substrate structure for a millimeter wave frequency band microstrip line circuit and an implementation method thereof, and relates to the technical field of printed circuit board manufacturing and millimeter wave circuit implementation. The substrate structure comprises a PCB (Printed Circuit Board) core and a PCB body, wherein the PCB body is constructed by alternativelyoverlapping semi-cured sheets, and is provided a plurality of circuit layers; the PCB body is provided with an accommodating cavity; the accommodating cavity at least passes through two circuit layers of the PCB body; a conductive support body and a hard dielectric substrate provided with a millimeter wave circuit in a distribution manner are arranged in the accommodating cavity; the conductive support body is grounded; a windowing layer is formed in the circuit layer of the PCB body through which the accommodating cavity passes; a windowing wall is formed on a contact surface of the windowing layer corresponding to the accommodating cavity; the windowing wall is grounded. By adopting the substrate structure, the advantages of a PCB process and a thin-film process are combined, a high-accuracy and high-index millimeter wave circuit can be realized on the PCB, and the selection range of a PCB application device is widened.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing and millimeter wave circuit realization, in particular to a matrix structure of a millimeter wave frequency band microstrip line circuit and a realization method thereof. Background technique [0002] Multilayer printed circuit board (PCB) is used as the carrier for the electrical connection of electronic components. It is widely used in the electronics industry, especially in radio frequency and microwave. It can not only provide carrier support for high-density active components, but also serve as a substrate for signal transmission lines. , Passive components such as filters, power splitters, couplers and other passive components with certain functions can also be produced through the design of specific conductor patterns. [0003] However, the traditional PCB has three shortcomings that limit its application in the millimeter-wave frequency band. First, the minimum ...

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Problems solved by technology

[0005] The present invention aims at the limitations of PCB boards in the application of millimeter-wave frequency band circuits in the prior art and the overall complex technical problems of the external bias of thin-film circuits, and proposes a matrix structure capable of realizing high performance and convenient integration of millimeter-wave circuits and its realization method

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