Reflow furnace smoke removing method

A reflow furnace and smoke technology, applied in auxiliary devices, auxiliary welding equipment, welding/cutting auxiliary equipment, etc., can solve the problems of poor removal effect, failure to ensure the purpose of welding the printed circuit board, etc., to avoid overheating and avoid deformation , the effect of efficient heat transfer

Inactive Publication Date: 2018-11-02
武汉倍普科技有限公司
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a method for removing smoke from the reflow furnace, which solves the problem that the existing removal methods have poor removal effects, and there are still smoke solidified crystals depo

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0019] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0020] The present invention provides a method for removing smoke from a reflow oven, which includes the following steps:

[0021] S1. First apply solder paste on the surface of the printed circuit board to be soldered, and put the printed circuit board with the applied solder paste into the reflow oven, so that the printed circuit board placed in the reflow oven enters the preheating zone, and The moisture in the solder paste evaporates, so that the flux wets the component pins and pad...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a reflow furnace smoke removing method and relates to the technical field of electronic equipment soldering. The reflow furnace smoke removing method comprises the steps that S1, the surface of a printed circuit board to be soldered is coated with soldering paste, the soldering paste coating printed circuit board is put into a reflow furnace, the printed circuit board put into the reflow furnace enters a preheating area, water in the soldering paste is evaporated, soldering flux is used for wetting a component pin and a bonding pad, and the soldering paste begins to soften and cover the bonding pad so that the component pin and the bonding pad are isolated from the oxygen; and S2, then the printed circuit board enters a reflow area. According to the reflow furnace smoke removing method, the smoke removing effect is greatly enhanced, smoke solidified crystals are prevented from depositing on fan blades, great centralized cooling and filtering treatment is carriedout on reflow gas with soldering flux smoke in the reflow furnace, the purpose of guaranteeing that the printed circuit board carries out soldering work well is achieved well, and therefore a manufacturing enterprise of the printed circuit board is completely facilitated.

Description

Technical field [0001] The present invention relates to the technical field of soldering of electronic devices, in particular to a method for removing smoke from a reflow oven. Background technique [0002] The solder paste is used for soldering in the reflow furnace. The solder paste is first applied to the soldering part of the printed circuit board with a printing device and a dispenser, and electronic components are mounted on the applied part. The soldering of the printed circuit board and electronic components is performed by heating the printed circuit board on which the electronic components are mounted in the reflow furnace, melting the solder paste, and the reflow furnace for soldering the printed circuit board is composed of a preliminary heating zone, a main heating zone, and a cooling zone. The printed circuit board coated with solder paste is pre-heated by the heater in the preliminary heating zone, and is mainly heated by the heater in the main heating zone, and co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B23K1/008B23K1/20B23K37/00H05K3/34B23K101/42
CPCB23K1/008B23K1/203B23K37/00H05K3/34
Inventor 丁凡
Owner 武汉倍普科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap