Novel planar cathode for vacuum magnetron sputtering

Abstract

The invention discloses a novel planar cathode for vacuum magnetron sputtering. The novel planar cathode includes a cathode shield, a protective pedestal is disposed at the middle part inside the cathode shield, the lower surface of the cathode shield is in bolted connection with a copper backboard, fixed magnets and electromagnetic plates are evenly connected between the upper surface of the copper backboard and the protective pedestal, cooling liquid in a cooling liquid holding box can be extracted into a cooling pipeline through a water pump, the cooling pipeline can be used for heat dissipation of a target material and the inside of the cathode shield, after heat absorption, heat of the cooling liquid can be dissipated through a radiating pipe, also gas can be extracted into a condenser through an air pump, and a rheostat is employed to adjust the magnetic force of an electromagnetic plate. The novel planar cathode for vacuum magnetron sputtering provided by the invention has the characteristics of simple structure and convenient operation, not only enables more convenient device installation, but also achieves better cooling effect, and can adjust the magnetic force more conveniently.

Description

technical field [0001] The invention relates to the technical field of magnetic field planar sputtering targets, in particular to a novel planar cathode for vacuum magnetron sputtering. Background technique [0002] Vacuum coating technology has been widely used in many fields such as microelectronics, aerospace, machinery manufacturing, and food packaging. Magnetron sputtering coating has the characteristics of low temperature and high speed, and can be mass-produced for a long time, but the existing planar cathode structure is complicated, and it is inconvenient to install, and the heat dissipation effect of the device is not good, it is inconvenient to use, and the magnetic force cannot be adjusted. , causing a lot of inconvenience to people. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the existing defects and provide a new type of planar cathode for vacuum magnetron sputtering, which has a simple struct...

AI Technical Summary

Problems solved by technology

Magnetron sputtering coating has the characteristics of low temperature and high speed, and can be mass-produced for a long time, but the existing planar cathode structure is complicated, and it is inconvenient to install, and the heat dissipation effect of the device is not good, it is inconvenient to use, and the magnetic force cannot be adjusted. , causing a lot of inconvenience to people

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