Package structure

A technology of packaging structure and packaging layer, which is applied to semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of increasing the volume of the packaging structure, unable to meet the design requirements of miniaturization, and increasing the number of circuit layers, etc. To achieve the effect of reducing the degree of impact
CN108735716BActive Publication Date: 2020-02-14POWERTECH TECHNOLOGY INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
POWERTECH TECHNOLOGY INC
Publication Date
2020-02-14

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Abstract

The invention provides a packaging structure, which includes a circuit carrier, a first chip, a packaging layer, a capacitor and an electromagnetic interference shielding layer. The circuit carrier includes a first pad and a second pad. The first chip is arranged on the circuit carrier and electrically connected with the circuit carrier. The encapsulation layer is disposed on the circuit carrier to cover the first chip. The capacitor includes a first capacitor electrode and a second capacitor electrode that are electrically separated. The first capacitor electrode and the second capacitor electrode are embedded in the encapsulation layer. The electromagnetic interference shielding layer covers at least the encapsulation layer. The first capacitor electrode and the second capacitor electrode extend from the circuit carrier toward the electromagnetic interference shielding layer. The electromagnetic interference shielding layer is grounded through the first capacitor electrode and the first pad. The second capacitor electrode is electrically connected to the second pad.
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Description

technical field

[0001] The present invention relates to a packaging structure, in particular to a packaging structure with the effect of electromagnetic interference shielding (EMI Shielding). Background technique

[0002] In today's packaging structure, the chip is electrically connected to the circuit carrier through bonding wires (Bondwire) or bumps (Bump), so that electronic signals can be transmitted between the chip and the circuit carrier or between chips. However, some chips, such as communication chips, will generate Electromagnetic Interference (EMI) and affect the operation of other chips (such as: data storage chips) in the package structure, so that the electronic signal transmission process between chips is accompanied by noise , thereby affecting the normal operation of the chip. In addition, under the consideration of power integrity (PI), how to ensure that a stable voltage can be provided to the chips in the package structure, especially when multiple chip...

Claims

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