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Photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, and can solve problems such as improved adhesion, defective components, and poor adhesion of substrates

Pending Publication Date: 2018-11-13
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the insulating film produced in this way has the problem of poor adhesion to the substrate, resulting in defective components
[0004] In order to solve such problems, attempts have been made to change the chemical structure of the photosensitive polyimide precursor. For example, Korean Patent Publication No. 10-2009-0096365 discloses a polyimide containing a specific structure and polyamic acid. imide composition, but in many cases there is a problem that the adhesion is improved and the heat resistance is lowered

Method used

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  • Photosensitive resin composition
  • Photosensitive resin composition
  • Photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0082] Preparation Example 1: Preparation of Acrylic Copolymer (Mw: 6000)

[0083] A mixed solution of 400 parts by weight of tetrahydrofuran, 30 parts by weight of methacrylic acid, 30 parts by weight of styrene, and 40 parts by weight of glycidyl methacrylate was placed in a flask equipped with a condenser and a stirrer. After the liquid composition was thoroughly mixed in a mixing vessel at 600 rpm, 15 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) was added. Slowly raise the temperature of the polymerization mixed solution to 55° C., keep at this temperature for 24 hours, then cool to normal temperature, and add 500 ppm of hydrogenated benzophenone (hydrobenzophenone) as a polymerization inhibitor to obtain a solid concentration of 30 wt. % polymer solution.

[0084]In order to remove unreacted monomers in the polymer solution, 100 parts by weight of the polymer solution were precipitated with respect to 1000 parts by weight of n-Hexane. After the precipitatio...

preparation example 2

[0086] Preparation Example 2: Preparation of Acrylic Copolymer (Mw: 1500)

[0087] Except for using 28 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile), an acrylic copolymer with a weight average molecular weight of 1500 was prepared by the same method as in Preparation Example 1 .

preparation example 3

[0088] Preparation Example 3: Preparation of Acrylic Copolymer (Mw: 3000)

[0089] Except for using 21 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile), an acrylic copolymer with a weight average molecular weight of 3000 was prepared by the same method as in Preparation Example 1 .

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Abstract

The present invention relates to a photosensitive resin composition. The photosensitive resin composition of the present invention uses an acrylic binder together with a polyimide precursor, thereby improving the adhesion to a substrate while maintaining the inherent heat resistance of the polyimide precursor.

Description

technical field [0001] The present invention relates to a photosensitive resin composition. Background technique [0002] Recently, AMOLED devices, which are superior to TFT-LCDs in terms of image quality and flexibility, are expanding their market dominance. AMOLED is an EL (organic light-emitting material) that receives electrical signals and directly emits light. When EL encounters a trace amount of gas (GAS), it will also be affected and oxidized, and eventually lose its device characteristics. Therefore, in an OLED device, an insulating film is formed using a polyimide-based photosensitive resin composition having excellent heat resistance and little outgassing. [0003] In particular, the photosensitive polyimide precursor has the advantage of being easy to pattern and obtain an insulating film excellent in heat resistance through thermal imidization treatment by coating, exposure, development, and curing. However, the insulating film produced in this way has a prob...

Claims

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Application Information

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IPC IPC(8): G03F7/033G03F7/004
CPCG03F7/004G03F7/033Y02E10/549G03F7/037G03F7/028
Inventor 金东明尹赫敏金珍善李炅娥柳真基
Owner DONGJIN SEMICHEM CO LTD