Semiconductor chip production technology

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and particularly discloses a semiconductor chip production technology. The technology comprises the following steps: putting wafers onto a grinding machine to be ground into mirror surfaces; putting the wafers into a high temperature diffusion furnace for oxidation treatment; after smearing the surfaces of the wafers witha photoresist, putting the wafers into a photoetching machine for exposure and developing; feeding the wafers into an etching machine for plasma etching; and feeding the wafers into the high temperature furnace for doping. In the grinding machine used in the technology, a circular arc-shaped sliding block is arranged on the waist-shaped hole of a fixed disc, a grinding device connected onto the circular arc-shaped sliding block through a connecting rod is in a floating state, and then the falling of silicon wafer particles inside a grinding disc is realized; the vibration of the grinding device at the lower end of the connecting rod is realized by setting cams with different initial angles; a balancing weight is arranged at the middle part of a transmission connecting rod, the rotation ofthe grinding disc in a fixed plane is realized, and then high-precision grinding of the surfaces of the wafers is realized.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to a semiconductor chip production process. Background technique [0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Wafer is the carrier used in the production of integrated circuits. In general, wafers refer to single crystal silicon wafers. Wafer is the most commonly used semiconductor material. According to its diameter, it is divided into 4 inches, 5 inches, 6 inches, 8 inches and other specifications. Recently, 12 inches or even larger specifications have been developed. The larger the wafer, the more ICs that can be produced on the same wafer, which can reduce costs; but the requirements for material technology and production technology are higher, such as uniformity and so on. In wafer manufacturing, with the upgrading of process technology and the reduction of wire and gate size, photolithograph...

AI Technical Summary

Problems solved by technology

However, the setting method of the grinding disc in this solution is inconvenient to clean the silicon wafer powder produced after grinding. The accumulation of silicon wafer powder in the grinding disc affects the processing accuracy of the silicon wafer; the vibration generated by the rotation of the grinding motor will be transmitted to the grinding disc , affecting the grinding accuracy of silicon wafers

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