Sensor LGA (Land Grid Array) packaging structure

Abstract

The invention provides a sensor LGA (Land Grid Array) packaging structure which comprises a shell and a substrate. The packaging structure is used for packaging an energy converter chip; the sensor LGA packaging structure also comprises a gasket; the gasket is used for adhering to the energy converter chip; a through hole is formed in the gasket in a way of penetrating through the upper surface and the lower surface; for the lower surface, connected with the substrate, of the bottom part of the gasket, due to the through hole, other areas of the gasket is adhered to the substrate through a glue. During the mass production of the packaging structure, the stress of the substrate can be optimized through the method, and the drifting problem of an electric signal output by the energy converterchip caused by the stress is solved.

Description

technical field [0001] The present invention relates to the field of sensor packaging, more specifically, to a sensor LGA packaging structure. Background technique [0002] Packaging technology is crucial for chips. At present, the packaging technology of semiconductor chips covers Filp Chip, COB and LGA in various forms. Among them, in view of the good performance of LGA packaging technology in terms of its interface richness, mechanical stability and heat dissipation, it has received more and more attention and attention. application. The full name of LGA is Land Grid Array, or flat grid array package, which belongs to the surface mount technology of integrated circuits (IC). Chips in this package are often connected or directly soldered to a printed circuit board (PCB substrate) superior. [0003] Specific to the LGA structure packaging of sensors, such as silicon microphones, pressure gauges, infrared sensors, thermometers, etc., the metal shell is often welded to the...

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