Automatic dispensing and curing system for silicon rod and automatic dispensing and curing method

Abstract

The invention provides an automatic dispensing and curing system for a silicon rod and an automatic dispensing and curing method. The system comprises a silicon rod body feeding device, a substrate feeding device, a stationary fixture feeding device, a dispensing chamber, a dispensing device arranged inside the dispensing chamber, a preliminary curing device, a secondary curing device for secondary curing of the silicon rod which has undergone preliminary curing by the preliminary curing device, and a control unit. A substrate discharging end of the substrate feeding device is close to a stationary fixture feeding end. The automatic dispensing and curing system for a silicon rod also comprises a second manipulator unit used for installing a substrate at the substrate discharging end to a stationary fixture at the stationary fixture feeding end, and a dismounting and transferring device. The second manipulator unit and the dismounting and transferring device are both in communication connection with the control unit. The whole silicon wafer machining process requires no manual operation to realize automatic dispensing and curing of the silicon rod, labor cost is saved, and the damage of newly produced silicon wafers due to man-made operation during the production process can be avoided and the loss is avoided; and the stationary fixture can be recycled.

Description

technical field [0001] The invention relates to a single crystal silicon bonding machine, in particular to an automatic glue dispensing and curing system and an automatic glue dispensing and curing method for silicon rods used for automatic dispensing and curing of silicon rods in an unmanned workshop. Background technique [0002] When manufacturing silicon wafers, it is necessary to sequentially bond the fixtures for fixing the silicon rods, the substrate and the silicon rods with glue. At present, generally, the bonding of the fixing fixtures, substrates and silicon rods is done manually, which leads to low production efficiency of silicon wafers and relatively high labor costs, which is not conducive to large-scale production of silicon wafers. [0003] At the same time, when the silicon wafer has just been produced, the glue has not yet completely solidified. At this time, the silicon wafer bonded on the substrate is easily affected by external forces (such as accidenta...

AI Technical Summary

Problems solved by technology

At present, the bonding of the fixing fixtures, substrates, and silicon rods is generally done manually, which makes the production efficiency of silicon wafers low and the labor cost is relatively high, which is not conducive to the realization of large-scale production of silicon wafers.

[0003] At the same time, when the silicon wafer has just been produced, the glue has not yet completely solidified. At this time, the silicon wafer bonded on the substrate is easily affected by external forces (such as accidental touch by the operator, light collision with other objects during the handling process) The role of skew, reduce the yield of silicon wafers

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