Microchannel plate assembly

Abstract

The invention discloses a microchannel plate assembly, which is mainly applied to fields such as time-of-flight mass spectrometry. The microchannel plate assembly comprises two microchannel plates, aninput electrode, an output electrode, an insulation ring, an anode, an insulation support structure, and an insulation cover plate, wherein a ring-shaped insulation gasket is arranged between the twomicrochannel plates, two staggered lead-out strips are integrally manufactured on the ring-shaped insulation gasket, and the thicknesses of the ring-shaped insulation gasket and the two lead-out strips range from 20 mu m to 280 mu m; metal film electrodes are respectively arranged on the two end surfaces of the ring-shaped insulation gasket through evaporation; and a metal film electrode is arranged on one end surface of each lead-out strip through evaporation, and is connected with the metal film electrode on the corresponding end surface of the insulation gasket. The microchannel plate assembly adopting the technical scheme has the advantages that flexible power supply modes can be adopted according to different situations of detected signals; and the minimum gap between the two microchannel plates is effectively ensured, so that ions incident on the microchannel plate assembly can be optimally detected.

Description

technical field [0001] The invention relates to a microchannel plate assembly, which belongs to the field of detection of vacuum charged particles or energetic photons. technical background [0002] Microchannel Plate (MCP) is a two-dimensional vacuum electron multiplier device with millions to tens of millions of micropores arranged in an orderly manner. The component composed of two microchannel plates in series (hereinafter referred to as the dual MCP component) is widely used in the fields of national defense, biomedicine and scientific instruments due to its small size, high gain, and fast response. Specifically, in microchannel plate photomultiplier tubes and time-of-flight detectors, two microchannel plates and different power supply methods are widely used to realize final photon or ion detection and imaging. [0003] Double MCP components can be assembled into four different structures, which are: (1) two MCPs are in direct contact; (2) only use ring-shaped metal g...

AI Technical Summary

Problems solved by technology

In the prior art, when the thickness of the metal electrode sheet is less than 100 μm, the difficulty of processing increases, the main performance is that it is difficult to remove the burr, and if it is thinner to a certain extent, curling will occur, which will easily cause ignition when the voltage is applied, and also give Assembling is difficult. Therefore, in the prior art, an electric field is applied between the two MCPs, and an insulating gasket and two ring electrodes are used. The thickness is generally more than 280 μm, which will make it difficult to exert the excellent performance of the component.

Images