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A panel and 3d printing device for 3d printing

A 3D printing and panel technology, applied in 3D object support structures, instruments, manufacturing tools, etc., can solve the problems of low physical and mechanical properties of printed entities, poor connectivity of printing materials, and poor quality of 3D printed entities. The effect of improving physical and mechanical properties, increasing printing continuity, and increasing printing efficiency

Active Publication Date: 2021-08-27
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when printing 3D entities to be printed with different thicknesses at various positions, due to the use of layered printing, the cohesion of the printed materials is not good at the thickness variation positions of different thicknesses, resulting in lower physical and mechanical properties of the printed entity , so that the quality of the 3D printed entity is poor

Method used

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  • A panel and 3d printing device for 3d printing
  • A panel and 3d printing device for 3d printing
  • A panel and 3d printing device for 3d printing

Examples

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Embodiment Construction

[0028] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0029] figure 1 A structural schematic diagram of a panel in a 3D printing device provided in the prior art. refer to figure 1 , the panel 00 includes scan lines (exemplarily, figure 1 In the first scanning line G1, the second scanning line G2, the third scanning line G3, the fourth scanning line G4 shown), the data line (for example, figure 1 shown in the first data line S1, the second data line S2, the third data line S3), a plurality of pixel units 01 and a common electrode line Vcom, each pixel unit 01 incl...

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PUM

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Abstract

The embodiment of the present invention discloses a panel and a 3D printing device. The panel includes: a plurality of pixel units, each of which includes an insulated pixel electrode and a common electrode; wherein, at least part of the common electrodes of the pixel units It includes one first sub-electrode and at least one second sub-electrode; the potential of at least one second sub-electrode is different from that of the first sub-electrode. Compared with the prior art, the panel provided by the embodiment of the present invention can make The thickness of different positions of the same printed thin layer can be different, thereby significantly improving printing efficiency; at the same time, it can also increase printing continuity and improve the physical and mechanical properties of the printed entity.

Description

technical field [0001] The invention relates to 3D printing technology, in particular to a panel and a 3D printing device. Background technique [0002] 3D (Dimension) printing technology is a rapid prototyping technology (Rapid Prototyping Manufacturing, RPM, also known as rapid prototyping manufacturing technology), which is based on digital files, using powdered metal or plastic and other bondable materials, through layer-by-layer printing way to construct entities. The basic principle of 3D printing technology is layered processing and superposition molding, that is, to generate 3D printing entities by adding materials layer by layer. Complete a series of digital slices in two directions, and transmit the information of these slices to the 3D printing device. The computer generates machine instructions based on the slices. The 3D printing device prints thin layers according to the machine instructions, and stacks the successively printed thin layers. , until a solid ob...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1343B29C64/129B29C64/286B33Y30/00
CPCB33Y30/00B29C64/129B29C64/286G02F1/1343G02F1/134309
Inventor 许祖钊席克瑞林柏全李金玉李小和刘金娥秦锋
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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