Novel multi-chip box for integrated circuit mask

Abstract

The invention discloses a novel multi-chip box for an integrated circuit mask. The novel multi-chip box for the integrated circuit mask comprises a box body, a box cover and a damping strip. Clampinghead are separately and fixedly connected to the two opposite side edges of the box body, clamping openings are separately and fixedly connected to the two opposite side edges of the box cover, four limiting blocks are fixedly connected to the inner side of the box body, and plastic pads are fixedly installed between the four limiting blocks. A plurality of limiting strips are evenly distributes on the inner wall of the box cover, the damping strip is arranged at the top of the box cover, two rectangular grooves are formed in two ends of the damping strip, a plurality of circular grooves are formed in the middle portion of the damping strip, and a plurality of first unwrapping parts and a plurality of second unwrapping parts are separately and fixedly connected to the two opposite side edges of the damping strip. The rectangular grooves are connected to a rectangular clamping column in a sleeving mode, and the circular grooves are connected to a circular clamping column in a sleeving mode. According to the novel multi-chip box for the integrated circuit mask, original rigid plastic materials of a box body clamping groove is changed into rubber materials, so that the integrated circuit mask is not prone to being crushed and damaged in the transportation process.

Description

technical field [0001] The invention relates to a multi-chip box, in particular to a novel multi-chip box for an integrated circuit reticle, and belongs to the technical field of integrated circuit storage devices. Background technique [0002] In the manufacturing process of semiconductors, integrated circuits, photovoltaic products and other electronic products, it is necessary to perform photolithography processing on various substrates represented by semiconductor wafers and photomasks, and the photolithography technology of masks is to write the customer's graphic files into The photoresist of the mask plate is then developed and etched. Since the photolithography process is very sensitive to pollution, the cleanliness of the photolithography process needs to be strictly controlled. Usually, the mask plate needs to be stored in a multi-piece box to avoid contamination during transmission. Damage and pollution, while the existing multi-chip cassettes use hard plastic car...

AI Technical Summary

Problems solved by technology

[0002] In the manufacturing process of semiconductors, integrated circuits, photovoltaic products and other electronic products, it is necessary to perform photolithography processing on various substrates represented by semiconductor wafers and photomasks, and the photolithography technology of masks is to write the customer's graphic files into The photoresist of the mask plate is then developed and etched. Since the photolithography process is very sensitive to pollution, the cleanliness of the photolithography process needs to be strictly controlled. Usually, the mask plate needs to be stored in a multi-piece box to avoid contamination during transmission. Damage and pollution, while the existing multi-chip box uses a hard plastic card slot as a shock-absorbing material, but the hard plastic card slot cannot effectively ensure the safety of the photomask, which is very easy to cause the photomask to be scratched and damaged

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