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Printed circuit board with blind hole instead of back drill hole and manufacturing method thereof

A technology of printed circuit board and manufacturing method, which is applied in the direction of printed circuit manufacturing, printed circuit, and electrical connection formation of printed components, etc., which can solve the problems of easy plugging of back-drilled holes, etc., and achieve the effect of simple structure and avoiding short circuit

Inactive Publication Date: 2018-11-30
珠海崇达电路技术有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problem that the existing back-drilling holes are easy to be blocked, the present invention provides a method for manufacturing printed circuit board back-drilling and a printed circuit board, which can effectively improve back-drilling and blocking holes

Method used

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  • Printed circuit board with blind hole instead of back drill hole and manufacturing method thereof
  • Printed circuit board with blind hole instead of back drill hole and manufacturing method thereof

Examples

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Embodiment 1

[0030] combine figure 1 and figure 2 As shown, this embodiment provides a method for manufacturing a printed circuit board with blind holes instead of back-drilled holes. The printed circuit board 1 is provided with blind holes 12, which constitute the inner layer of the printed circuit board. The area on the inner board used to make blind holes is called the blind hole position, and the inner board adjacent to the bottom of the 12-hole blind hole is called the inner layer isolation board 2, and the inner layer isolation board 2 is connected to the bottom of the 12-hole blind hole. The adjacent side and the area opposite to the bottom of the blind hole 12 are called isolation positions; in the present embodiment, as figure 2 As shown, the layers L3-L6 are laminates that need to be connected, and there are blind holes 12 on the layers L3-L6, and the layer L2 is the inner layer isolation board 2;

[0031] Described preparation method comprises the following steps:

[0032] ...

Embodiment 2

[0044] Such as figure 2 As shown, this embodiment provides a printed circuit board with blind holes instead of back-drilled holes, and the multiple laminates that need to be connected to the printed circuit board are connected through electroplated blind holes 12, and the blind holes 12 are connected to each other. The inner layer board adjacent to the bottom is called the inner layer isolation board 2, and the copper at the side adjacent to the bottom of the blind hole 12 and the area opposite to the bottom of the blind hole 12 is etched away to form an isolation board. Zone 21; in this embodiment, as figure 2 As shown, the layers L3-L6 are laminates to be connected, the layers L3-L6 are provided with blind holes 12 , and the layer L2 is the inner isolation board 2 .

[0045] Specifically, the depth of the blind hole 12 is smaller than the distance from the isolation hole 21 to the opening end of the blind hole 12, that is, the distance from L2 to L6, so that even if the i...

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Abstract

The invention provides a manufacturing method of a printed circuit board with a blind hole instead of a back drill hole, comprising the following steps: S1, cutting and preparing each inner layer plate; etching and removing copper at an isolation position to form an isolation region; S2, preparing a multi-layer production board; S3, drilling blind holes in the corresponding blind hole position onthe multi-layer production board, and drilling through holes in the multi-layer production board; S4, adopting a copper plating and whole-plate electroplating process to make the through holes in themulti-layer production board metallized; S5, using a whole-plate hole filling electroplating process to plate copper on the blind holes so as to metallize the blind holes; S6, manufacturing an outer layer circuit pattern on the multi-layer production board, and electroplating copper and electroplating tin; S7, stripping membrane and manufacturing a cover hole pattern on the multi-layer productionboard for blocking the hole port of the blind hole; S8, removing a copper plane exposed on the multi-layer production board by etching; then, removing the tin and manufacturing an outer-layer circuiton the multi-layer production board; S9, manufacturing a finished product of the printed circuit board. The invention further provides a printed circuit board with the blind hole instead of the back drill hole.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a printed circuit board with blind holes instead of back-drilled holes and a production method thereof. Background technique [0002] In high-speed signal transmission printed circuit boards, the electroplated copper in the via hole becomes the "stubs" of signal transmission, which has an adverse effect on signal transmission. In order to obtain better signal integrity, it is necessary Reduce the length of the stubs in the hole. And the shorter the length of the residual stubs, the better the signal integrity. [0003] Back-drilling removes stubs by secondary drilling to reduce signal distortion caused by transmission reflection, scattering, and delay. The base material of printed circuit boards, the drill chips are a mixture of copper wire and resin, and the chip removal groove of the drill nozzle is difficult to remove. At the same time, the through hole has ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0047H05K3/421H05K3/429
Inventor 莫崇明彭卫红杜明星
Owner 珠海崇达电路技术有限公司
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