Film for forming protective coating and composite sheet for forming protective coating

A technology of protective film and composite sheet, which can be used in the direction of film/sheet adhesive, coating, electrical components, etc., which can solve problems such as shortening curing time

Pending Publication Date: 2018-12-21
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, heat curing of a thermosetting protective film forming film generally takes a long time of several hours, so it is desired to shorten the curing time.

Method used

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  • Film for forming protective coating and composite sheet for forming protective coating
  • Film for forming protective coating and composite sheet for forming protective coating
  • Film for forming protective coating and composite sheet for forming protective coating

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0270] >

[0271] Adhesive compositions (I-1) to (I-3) can be obtained by mixing the above-mentioned adhesive and, if necessary, components other than the above-mentioned adhesive, and other components for constituting the adhesive composition. Adhesive compositions other than the adhesive compositions (I-1) to (I-3) such as the adhesive composition (I-4).

[0272] The order of addition when blending each component is not specifically limited, Two or more components may be added simultaneously.

[0273] When a solvent is used, it can be used by mixing the solvent with any blending component other than the solvent and prediluting the blending component. Moreover, you may use by mixing a solvent with these blending components, without pre-diluting any blending components other than a solvent.

[0274] There is no particular limitation on the method of mixing the respective components at the time of blending. For example, what is necessary is just to select suitably from the f...

Embodiment 1

[0513]

[0514] (Preparation of protective film-forming composition (IV-1))

[0515] Energy ray curable component (a2)-1, polymer (b)-1, photoradical initiator (c')-1, photoradical initiator (c')-2, filler (d) -1. Dissolve or disperse in methyl ethyl ketone so that the content (solid content, parts by mass) of the coupling agent (e)-1 and the coloring agent (g)-1 becomes the value shown in Table 1, and It stirred at 23 degreeC, and the composition (IV-1) for protective film formation with a solid content concentration of 50 mass % was prepared by this. In addition, description of "-" in the column containing a component in Table 1 means that the composition for protective film formation (IV-1) does not contain this component.

[0516] (Preparation of Adhesive Composition (I-4))

[0517] An acrylic polymer (100 parts by mass, solid content) and a trifunctional xylylene diisocyanate crosslinking agent ("TAKENATE D110N" manufactured by Mitsui Takeda Chemical Co., Ltd.) (10.7 ...

Embodiment 2

[0532] The film (13)-2 for protective film formation was produced by the method similar to Example 1 except having used (c')-1 as a photoradical generator and the addition amount was 0.6 mass part. Furthermore, the composite sheet for protective film formation was manufactured using this, and the characteristic was evaluated. The results are shown in Table 2.

[0533]

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Abstract

Provided are a film for forming a protective coating and a composite sheet for forming a protective coating, both of which can prevent curing defects even in the presence of oxygen. Said film for forming a protective coating can be cured by energy rays, and a photoradical initiator having a 365-nm light absorption coefficient is added in the amount of at least 4.0*101 ml/(g.cm) to said film for forming a protective coating. The photoradical initiator is preferably a hydrogen-abstraction photoradical initiator having at least three aromatic rings in one molecule, and preferably a photoradical initiator having at least two photodegradable groups in one molecule.

Description

technical field [0001] The present invention relates to a film for protective film formation and a composite sheet for protective film formation. [0002] This application claims priority based on Japanese Patent Application No. 2016-092011 for which it applied in Japan on April 28, 2016, and uses the content here. Background technique [0003] In recent years, semiconductor devices using a mounting method called a so-called face down method are being manufactured. In the flip-chip method, a semiconductor chip having electrodes such as bumps on a circuit surface, and the electrodes are bonded to a substrate is used. Therefore, the back surface of the semiconductor chip opposite to the circuit surface may be exposed. [0004] A resin film containing an organic material is formed as a protective film on the back surface of the exposed semiconductor chip, and this may be incorporated into a semiconductor device as a semiconductor chip with a protective film. Protective films...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D201/00B32B7/02C09D4/02C09D7/40C09J7/20C09J201/00H01L21/301
CPCC09D201/00C09J201/00C09D7/40C09J7/20
Inventor 米山裕之稻男洋一小桥力也
Owner LINTEC CORP
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