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RF interconnects between printed circuit boards and waveguides

A printed circuit board and waveguide technology, applied in the field of printed circuit board itself, can solve the problems of physical incompatibility, bulkiness, bulky, etc., and achieve the effect of simple implementation and easy manufacture

Active Publication Date: 2020-11-03
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As such, they are bulky, heavy, and physically incompatible with other parts of the overall radio system (for example, RF transceivers or antennas), and are often developed on printed circuit boards (PCBs)

Method used

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  • RF interconnects between printed circuit boards and waveguides
  • RF interconnects between printed circuit boards and waveguides
  • RF interconnects between printed circuit boards and waveguides

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Embodiment Construction

[0041] In general, it has to be noted that all structures, devices, elements, units and means etc. described in this application may be implemented by software or hardware elements or any type of combination thereof. All steps performed by various entities described in this application, and functions described as performed by various entities, are intended to mean that the corresponding entities are adapted or used to perform the corresponding steps and functions. Even though in the following description of a specific embodiment, a specific function or step performed by a generic entity is not reflected in the description of specific detail elements of the entity performing the specific step or function, those skilled in the art should understand that these elements and Functions may be implemented in respective hardware or software elements or any type of combination thereof. Further, the method of the present invention and each step thereof are embodied in the functions of e...

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Abstract

According to one aspect the present invention refers to a system comprising a waveguide having a body with a first end having an opening, and a printed circuit board, PCB, having a bottom side and a opposed top side, wherein the PCB comprises a ground layer, a dielectric material layer and a signal layer arranged in a layer stack from the bottom side to the top side of the PCB, wherein the dielectric material layer is arranged between the ground layer and the signal layer, wherein the signal layer comprises a coupling pad and a first and a second output transmission line both connected to the coupling pad, further comprising a non-conducting slot in the ground layer, further comprising a electric wall galvanically connecting the coupling pad through the dielectric material layer to the ground layer, wherein the first end of the waveguide is arranged on the bottom side and is galvanically connected with the ground layer, wherein the opening, the non-conducting slot and the coupling pad are aligned such that in a stacking direction of the layer stack the opening, the non-conducting slot and the coupling pad at least partially overlap. In a second aspect the present invention is directed to a printed circuit board, PCB, having a bottom side and a opposed top side, wherein the PCB comprises a ground layer, a dielectric material layer and a signal layer arranged in a layer stack from the bottom side to the top side of the PCB, wherein the dielectric material layer is arranged between the ground layer and the signal layer, wherein the signal layer comprises a coupling pad and a first and a second output transmission line both connected to the coupling pad, further comprising a non-conducting slot in the ground layer, further comprising a electric wall galvanically connecting the coupling pad through the dielectric material layer to the ground layer, wherein the non-conducting slot and the coupling pad are aligned such that in a stacking direction of the layer stack the non-conducting slot and the coupling pad at least partially overlap.

Description

technical field [0001] The invention relates to a system comprising a waveguide and a printed circuit board (PCB) and the printed circuit board itself. Background technique [0002] Rectangular waveguides are often used in high frequency / millimeter wave (mmW) applications to transmit or filter mmW signals with minimal power loss and / or signal distortion. Furthermore, transmission lines / filters based on rectangular waveguides are typically built from blocks of aluminum by milling rectangular cavities in the aluminum. As such, they are bulky, heavy, and physically incompatible with other components of the overall radio system (eg, RF transceivers or antennas), and are often developed on printed circuit boards (PCBs). Therefore, for the integration of PCB-based RF components with waveguide-based components, a well-designed rectangular waveguide to PCB-based transmission line / from PCB-based transmission line to rectangular waveguide (e.g., microstrip line, stripline, etc.) is r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/107
CPCH01P5/107
Inventor 克里斯托夫·施普兰格尔提托·科基诺斯阿杰·巴布·冈图帕里法比奥·摩根布鲁诺·比斯孔蒂尼
Owner HUAWEI TECH CO LTD