A rotatable omni-directional electroplating device for electronic components

Abstract

The invention discloses a rotatable omni-directional electroplating device for electronic elements. The rotatable omni-directional electroplating device includes a main body frame, pressure-bearing springs and an electric rotary table, the main body frame is internally provided with a power output device, and the upper portion of the main body frame is provided with a supporting base; an operationplatform is arranged on the upper portion of the supporting base, and a fixed bearing is arranged inside the operation platform; and the fixed bearing is internally provided with a bearing column, the upper portion of the bearing column is connected with an outer surround, the lower end of a built-in base is internally provided with a positioning block, and the upper end of a moving rotary tableis internally provided with a positioning socket. According to the rotatable omni-directional electroplating device for the electronic elements, compared with existing ordinary electroplating devices,the use performance of the rotatable omni-directional electroplating device is greatly improved while increasing the structure, the improved rotatable omni-directional electroplating device has a better and more comprehensive electroplating capability and a bidirectional staggered rotation capability, the machining efficiency of the electronic elements is indirectly improved, and the use demandsof people is effectively met.

Description

technical field [0001] The invention relates to the technical field of electroplating devices for electronic components, in particular to a rotatable omnidirectional electroplating device for electronic components. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation. Improve wear resistance, conductivity, reflectivity, corrosion resistance and enhance the appearance; the outer layer of many coins is also electroplated; during electroplating, the plated metal or other insoluble materials are used as the anode, and the workpiece to be plated is used as the cathode. Metal cations are reduced on the surface of the workpiece to be plated to form a coating; in order to eliminate the interference of other cations ...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of rotatable all-round electroplating device for electronic components, to solve the problem that the general electroplating device structure proposed in the above background technology is relatively simple, there are also manual operation equipment, and the processing technology of common equipment during use Insufficient performance, and the comprehensiveness of the electroplating of electronic components is not enough, which leads to the reduction of the production efficiency of electronic components, indirectly increases the occurrence rate of defective products, and cannot well meet people's use needs.

Images