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Label feeding and discharging device and wafer labeling equipment for integrated circuit

A technology of feeding and unloading and labeling, applied in the field of wafer labeling equipment, can solve the problems of low processing efficiency and yield, low processing efficiency, high production cost, etc., achieve high processing efficiency and processing yield, and facilitate loading and unloading and labeling Marking, efficient loading and unloading effects

Active Publication Date: 2018-12-28
靖江佳仁半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The shortcomings of the existing equipment are: 1. A set of equipment can only operate on one size of wafer, and the wafer size is not compatible, resulting in high production costs; 2. The pre-printed label is pasted on the wafer, It is impossible to temporarily change the label, and the automation rate of label affixing is low; 3. The wafer loading and unloading is operated separately, resulting in low processing efficiency; 4. The wafer is small in size and inconvenient for clamping and positioning, resulting in low processing efficiency and yield

Method used

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  • Label feeding and discharging device and wafer labeling equipment for integrated circuit
  • Label feeding and discharging device and wafer labeling equipment for integrated circuit
  • Label feeding and discharging device and wafer labeling equipment for integrated circuit

Examples

Experimental program
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Effect test

Embodiment 1

[0023] Such as figure 2 and image 3 The shown label feeding and discharging device includes a barrel mounting plate 11, a receiving barrel 12, a feeding barrel 13, a first motor 14, a guide rod 15, a code printer 16, a guide rod positioning assembly 17, and a code printer Fixed seat 18, discharge ramp 19 and feed detector 110. Feeding barrel 13 and receiving barrel 12 are rotatably connected on the barrel mounting plate 11, receiving barrel 12 is used for winding the recovered material tape, and feeding barrel 13 is used for winding blank labels to be coded. The material barrel 13 is located below the material receiving barrel 12 . The first motor 14 is installed on the barrel mounting plate 11, the output shaft of the first motor 14 is connected with the rotating shaft of the receiving barrel 12, and the first motor 14 drives the receiving barrel 12 to rotate, so that the feeding barrel 13 is passively rotated . The guide bar 15 is connected on the barrel mounting plate...

Embodiment 2

[0028] Such as Figure 1-Figure 11 The wafer labeling equipment for integrated circuits shown includes a frame 7 and a label feeding and discharging device 1 on it, a wafer feeding and discharging device 2, a label moving device 3, a wafer fixing device 4, a labeling detection device 5 and Wafer transfer device 6.

[0029] The wafer feeding and discharging device 2 is connected with the wafer fixing device 4 through the label moving device 3, and the wafer fixing device 4 is connected with the wafer feeding and discharging device 2. The labeling detection device 5 is located directly above the wafer fixing device 4. The position of the circular transfer device 6 corresponds to the wafer feeding and unloading device 2 and the wafer fixing device 4 .

[0030] The label feeding and discharging device 1 is used for blank label feeding, label spraying and recycling of waste paper. The wafer feeding and unloading device 2 is used for loading wafers to be labeled and unloading fini...

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PUM

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Abstract

The invention relates to the technical field of integrated circuits, and discloses a label feeding and discharging device. The label feeding and discharging device comprises a material barrel mountingplate, a material collecting barrel, a feeding barrel, a first motor, a guide rod, a code spurting printer, a guide rod positioning assembly, a code spurting printer fixing seat, a discharging slantbar and a feeding detector. The label feeding and discharging device has the advantages that label information can be changed conveniently by controlling a printer only, and a label tape is not required to be replaced.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to wafer labeling equipment. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Millions of transistors can be etched on the wafer through a special process, and it is widely used in the manufacture of integrated circuits. After the wafer processing is completed, a label needs to be attached to it. The existing labeling operation method is: first fix the wafer, then paste the pre-printed label on the wafer, remove the labeled wafer and continue Load the wafers to be labeled and repeat. The shortcomings of the existing equipment are: 1. A set of equipment can only operate on one size of wafer, and the wafer size is not compatible, resulting in high production costs; 2. The pre-printed label is pasted on the wafer, It is impossible to temporarily change the label, and the automation rate of...

Claims

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Application Information

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IPC IPC(8): B65C9/18B65C9/46B65C9/02
CPCB65C9/02B65C9/1819B65C9/46
Inventor 吴美珍
Owner 靖江佳仁半导体科技有限公司