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Ceramic radiator and manufacturing method thereof

A manufacturing method and technology of radiator, applied in cooling/ventilation/heating transformation, modification by conduction and heat transfer, transportation and packaging, etc., can solve the problem of inability to meet quality requirements, difficult demoulding, and actual production of ceramic radiators And other issues

Active Publication Date: 2020-10-20
谢孟修
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  • Abstract
  • Description
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Problems solved by technology

As shown in the figure, although the higher ridges of the ceramic heat sink can increase the heat dissipation surface area, in practice, the ceramic heat sink cannot be manufactured as ideal. When the body is formed, its material is easy to stick to the mold, which makes it difficult to demould, and finally causes the embryo body to collapse at the convex line after demoulding, so that it cannot meet the quality requirements

Method used

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  • Ceramic radiator and manufacturing method thereof
  • Ceramic radiator and manufacturing method thereof
  • Ceramic radiator and manufacturing method thereof

Examples

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Embodiment 1

[0028] figure 1 and figure 2 A preferred embodiment of the ceramic heat sink 100 of the present invention is shown. The ceramic heat sink 100 includes a ceramic body (not numbered in the figure) sintered and molded from composite powder materials. As shown in the figure, the ceramic body includes a backing plate 1 (backing plate) and a plurality of slightly higher square protrusions 2 integrally extending from the front of the backing plate 1 . The composite powder material is mixed with nitride ceramic powder and titanium metal powder.

[0029] In this preferred embodiment, the nitride ceramic powder is mixed with a first nitride powder with better heat absorption (for example: silicon nitride) and a second nitride powder with better heat dissipation (for example: nitride boron). Wherein, the content of the titanium metal powder is higher than that of the second nitride powder, and the content of the second nitride powder is higher than that of the first nitride powder....

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Abstract

The present invention relates to a ceramic radiator and a manufacturing method thereof. The ceramic radiator comprises a ceramic body formed by sintering a composite powder material, wherein the composite powder material is mixed with nitride ceramic powder and titanium metal powder. The manufacturing method includes: mixing and processing materials such as nitride ceramic powder, titanium metal powder, and inorganic resin to form a mixed material; then, injecting the mixed material into a titanium-coated forming mold on the inner wall, and pressing it into an embryo; finally, The green body is sintered to form the ceramic heat sink. Since titanium metal powder is added to the mixed material and the inner wall surface of the forming mold is also plated with titanium metal, the formed embryo can be easily demolded after compression molding, and will not stick to the mold and cause collapse .

Description

technical field [0001] The invention relates to a radiator for electronic components and its manufacturing method, especially a ceramic radiator with good heat dissipation effect and easy manufacture and its manufacturing method. Background technique [0002] The heat sink is used to stick on the electronic component to help the electronic component to dissipate heat, so that the electronic component can maintain normal operation at an appropriate temperature. Generally speaking, the larger the surface area of ​​the heat sink, the better the heat dissipation. [0003] refer to Figure 5 , the existing radiator 5 is formed by extruding or die-casting materials with good thermal conductivity such as aluminum, which includes a base 51 and a plurality of cooling fins 52 arranged on the base 51 . The base 51 is a square plate, which is used to attach directly to the electronic component 5, so as to absorb the heat emitted by the electronic component. The heat dissipation fins 5...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20B22F5/00C22C29/16
CPCH05K7/2039C22C29/16B22F5/00B22F2998/10B22F1/10B22F3/10B22F2003/026
Inventor 谢孟修
Owner 谢孟修
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