PPS material used for shell of electronic device and preparation method of PPS material

Abstract

The invention relates to the technical field of PPS materials, in particular to a PPS material used for a shell of an electronic device and a preparation method of the PPS material. The PPS material comprises 80-100 parts of PPS, 10-20 parts of glass fibers, 50-60 parts of heat conductive fibers, 6-10 parts of wollastonite, 1-3 parts of lubricating agent, 0.1-1 part of antioxidant and 0.1-1 part of heat stabilizer, wherein the heat conductive fibers are composed of polyacrylonitrile fiber filaments and nanometer heat conductive filler which is uniformly distributed on the surfaces of the polyacrylonitrile fiber filaments. According to the PPS material, the polyacrylonitrile fiber filaments are used as the matrix of the heat conductive fibers, the polyacrylonitrile fiber filaments can cooperate with the glass fibers to improve the tensile strength, the bending strength and the anti-impact strength of the PPS material, accordingly, the using quantity of the glass fibers is effectively reduced, and the phenomenon that the glass fibers are exposed is avoided. By adding the wollastonite, the lubricating agent, the heat stabilizer and the antioxidant, the strength and the durability of the PPS material can be further improved, and the processing difficulty can be reduced.

Description

technical field [0001] The invention relates to the technical field of PPS materials, in particular to a PPS material used for electronic device casings and a preparation method thereof. Background technique [0002] With the rapid development of microelectronic integration technology and assembly technology, the assembly density has increased rapidly, the volume of electronic components and logic circuits has been reduced by thousands of times, electronic instruments have become thinner and smaller, and the operating frequency has increased sharply. change rapidly. At this time, the heat generated by the electronic equipment accumulates and increases rapidly. To ensure that the electronic components can still work normally with high reliability under the ambient temperature, timely heat dissipation becomes an important limiting factor affecting their service life. In order to ensure the operation of the components Therefore, there is an urgent need to develop thermally con...

AI Technical Summary

Problems solved by technology

However, the addition of glass fiber and thermally conductive filler often requires a relatively high ratio to have a significant improvement effect, and when the glass fiber content is too high, it will bring great difficulties to processing, and the resulting material is often prone to glass fiber exposure, or even Performance deterioration; thermally conductive fillers are rigid materials, directly adding them to PPS will easily lead to enhanced brittleness of PPS, and a small amount of thermally conductive fillers can hardly form sufficient thermal conduction paths in PPS, resulting in poor thermal conductivity

Images